NANIUM Extends eWLB to Achieve Higher Reliability
October 29, 2013 08:00 ET
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NANIUM S.A.
VILA DO CONDE, PORTUGAL--(Marketwired - Oct 29, 2013) - NANIUM S.A., Europe's largest outsourced semiconductor assembly and test (OSAT) service provider, today announced the introduction of an...
STATS ChipPAC Delivers Industry Leading Ultra Thin Package-on-Package Solutions With eWLB Packaging
August 19, 2013 17:00 ET
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STATS ChipPAC
SINGAPORE -- 20 AUGUST 2013, UNITED STATES--(Marketwired - Aug 19, 2013) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of...
STATS ChipPAC Celebrates 1,000th U.S. Patent Milestone
July 01, 2013 17:00 ET
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STATS ChipPAC
SINGAPORE -- 02 JULY 2013, UNITED STATES--(Marketwired - Jul 1, 2013) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced...
STATS ChipPAC's Advanced eWLB Provides a Versatile Integration Platform for the 2.5D and 3D Technology Evolution
November 05, 2012 16:00 ET
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STATS ChipPAC
SINGAPORE -- 6 NOVEMBER 2012, UNITED STATES--(Marketwire - Nov 5, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced...
STATS ChipPAC's Fan-Out Wafer Technology Platform Delivers High Performance, Highly Integrated Solutions in a Wide Range of Package Configurations
May 31, 2011 13:30 ET
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STATS ChipPAC
SINGAPORE -- 6/1/2011, UNITED STATES--(Marketwire - May 31, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...