GlobeNewswire: FEI Company Contains the last 10 of 203 releaseshttp://www.globenewswire.com/External?Length=42024-03-19T04:02:44ZGlobeNewswirehttp://www.globenewswire.com/External?Length=4newsdesk@globenewswire.com (NewsDesk)https://www.globenewswire.com/news-release/2016/08/31/868401/0/en/FEI-Celebrates-Shipment-of-1-000th-Helios-DualBeam-System.html?f=22&fvtc=4&fvtv=10250FEI Celebrates Shipment of 1,000th Helios DualBeam System2016-08-31T12:15:00Z<![CDATA[FEI’s Helios Family has lead the DualBeam technology race and is widely used across the semiconductor, materials science, life sciences and oil & gas industries FEI’s Helios Family has lead the DualBeam technology race and is widely used across the semiconductor, materials science, life sciences and oil & gas industries]]>https://www.globenewswire.com/news-release/2016/08/30/868142/0/en/FEI-Shareholders-Approve-Acquisition-by-Thermo-Fisher-Scientific.html?f=22&fvtc=4&fvtv=10250FEI Shareholders Approve Acquisition by Thermo Fisher Scientific 2016-08-30T20:19:33Z<![CDATA[HILLSBORO, Ore., Aug. 30, 2016 (GLOBE NEWSWIRE) -- FEI Company (Nasdaq:FEIC) today announced that at the special meeting of FEI’s shareholders held on August 30, 2016, its shareholders overwhelmingly approved the previously announced acquisition of FEI by Thermo Fisher Scientific Inc. (NYSE:TMO).  The transaction is expected to be completed by the end of 2016, subject to the satisfaction of customary closing conditions, including applicable regulatory approvals.]]>https://www.globenewswire.com/news-release/2016/08/22/865842/0/en/FEI-Introduces-New-Talos-S-TEM-for-Life-and-Materials-Sciences.html?f=22&fvtc=4&fvtv=10250FEI Introduces New Talos S/TEM for Life and Materials Sciences2016-08-22T12:15:00Z<![CDATA[Fast, sophisticated automation and advanced 3D imaging workflows allow applied researchers to focus on scientific questions rather than microscope operation.]]>https://www.globenewswire.com/news-release/2016/08/04/861866/0/en/FEI-Reports-Second-Quarter-2016-Results.html?f=22&fvtc=4&fvtv=10250FEI Reports Second Quarter 2016 Results2016-08-04T20:05:00Z<![CDATA[HILLSBORO, Ore., Aug. 04, 2016 (GLOBE NEWSWIRE) -- FEI Company (Nasdaq:FEIC) today reported results for the second quarter of 2016.  Second quarter revenue of $259 million was up 16% compared with $224 million for the second quarter of 2015.  The company’s backlog of orders at the end of the second quarter of 2016 was $651 million compared with $541 million at the end of the second quarter of 2015.  Bookings for the second quarter of 2016 were $259 million, resulting in a book-to-bill ratio of 1.0-to-1.]]>https://www.globenewswire.com/news-release/2016/07/14/856008/0/en/FEI-s-New-Themis-Z-S-TEM-Sets-New-Standards-for-High-Performance-Imaging-and-Analysis.html?f=22&fvtc=4&fvtv=10250FEI’s New Themis Z S/TEM Sets New Standards for High Performance Imaging and Analysis2016-07-14T12:15:00Z<![CDATA[Themis Z S/TEM, the latest in the Themis line, delivers the highest resolution, fastest analysis and best light element imaging commercially available Themis Z S/TEM, the latest in the Themis line, delivers the highest resolution, fastest analysis and best light element imaging commercially available]]>https://www.globenewswire.com/news-release/2016/06/27/851523/0/en/FEI-Launches-Helios-G4-DualBeam-Series-for-Materials-Science.html?f=22&fvtc=4&fvtv=10250FEI Launches Helios G4 DualBeam Series for Materials Science2016-06-27T12:15:00Z<![CDATA[The Helios G4 DualBeam Series features new capabilities to enable scientists and engineers to answer the most demanding and challenging scientific questions The Helios G4 DualBeam Series features new capabilities to enable scientists and engineers to answer the most demanding and challenging scientific questions]]>https://www.globenewswire.com/news-release/2016/06/16/849089/0/en/FEI-Launches-Three-New-Tools-for-Next-Generation-Semiconductor-Manufacturing.html?f=22&fvtc=4&fvtv=10250FEI Launches Three New Tools for Next-Generation Semiconductor Manufacturing2016-06-16T12:15:00Z<![CDATA[New solutions are designed to address the challenges of 7nm technology node metrology and defect/failure analysis. New solutions are designed to address the challenges of 7nm technology node metrology and defect/failure analysis.]]>https://www.globenewswire.com/news-release/2016/06/09/847506/0/en/FEI-Announces-Quarterly-Cash-Dividend-of-0-30-per-Share.html?f=22&fvtc=4&fvtv=10250FEI Announces Quarterly Cash Dividend of $0.30 per Share2016-06-09T20:05:00Z<![CDATA[HILLSBORO, Ore., June 09, 2016 (GLOBE NEWSWIRE) -- FEI Company (NASDAQ:FEIC) announced that its board of directors has approved payment of a quarterly dividend of $0.30 per share of common stock.  The dividend will be paid on July 20, 2016 to shareholders of record as of the close of business on July 7, 2016.]]>https://www.globenewswire.com/news-release/2016/05/04/836758/0/en/FEI-Reports-First-Quarter-2016-Results.html?f=22&fvtc=4&fvtv=10250FEI Reports First Quarter 2016 Results2016-05-04T20:05:00Z<![CDATA[Record First Quarter Bookings of $272 Million and Backlog of $656 Million Record First Quarter Bookings of $272 Million and Backlog of $656 Million]]>https://www.globenewswire.com/news-release/2016/05/03/835988/0/en/FEI-Launches-Apreo-Industry-Leading-Versatile-High-Performance-SEM.html?f=22&fvtc=4&fvtv=10250FEI Launches Apreo – Industry-Leading Versatile, High-Performance SEM2016-05-03T12:15:00Z<![CDATA[The Apreo SEM provides high-resolution surface information with excellent contrast, and the flexibility to accommodate a large range of samples, applications and conditions The Apreo SEM provides high-resolution surface information with excellent contrast, and the flexibility to accommodate a large range of samples, applications and conditions]]>