SCOTTS VALLEY, Calif., Jan. 31, 2006 (PRIMEZONE) -- Carsem, Inc., a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that Mr. Oliver Davis has joined the company as the Director of Marketing and is replacing Mr. Paul Smith, who has announced his retirement effective at the end of February. Mr. Davis is based in the Scotts Valley, California office and reports to Mr. Rick Flowers, Carsem's V.P. of Sales for North America.
Mr. Davis has over 26 years of experience in the semiconductor industry. Prior to joining Carsem, he was the Director of Sales and Engineering at Signetics High Technology and prior to that he was a Senior Sales Account Manager at ASAT, Inc. His previous positions in the industry include Test Operations Manager at Chips and Technologies and the Northwest Regional Manager for Field Service of ATE equipment at Schlumberger Technologies.
Mr. Flowers stated, "I am very pleased to have Oliver join our Carsem team. His broad-based experience in our industry will provide new dynamics to the future growth of Carsem."
"I look forward to helping strengthen and enhance Carsem's position in the market," stated Mr. Davis.
Flowers further stated, "Paul has been a tremendous asset to Carsem and his contacts, knowledge of our industry, and expert guidance has helped bring about industry recognition of the Carsem name. We all wish him the best of luck in his retirement years."
"It has been an honor and a privilege to be part of the Carsem organization. I will certainly miss working with such a great team of people," said Smith.
About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package and test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. The company's factories maintain world-class quality standards, having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported by a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group, with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the U.S., plus the U.K. and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, Calif. 95066, phone (831) 438-6861, fax (831) 438-6863, Web site: www.carsem.com.