Industrial Electronics Packaging Market to attain a net worth of US$ 2.5 Bn by the end of 2029 - Comprehensive Research Report by FMI

Industrial Electronics Packaging Market - Analysis, Outlook, Growth, Trends, Forecasts


DUBAI, United Arab Emirates, Jan. 18, 2022 (GLOBE NEWSWIRE) -- The global industrial electronics packaging market currently enjoys a valuation of US$ 1.9 Bn, and is predicted to expand at a CAGR of 4.1% to attain a net worth of US$ 2.5 Bn by the end of 2029. 

Industrial Electronics Packaging Market Size (2022)US$ 1.9 Bn
Estimated Market Worth (2029)US$ 2.5 Bn
Global Market Growth (2022-2029)4.1% CAGR
Dominant Material for Packaging Industrial Electronic ProductsPlastic – 57.4% Share

Nearly 3.5% annual growth is expected in the volume consumption of industrial electronics packaging solutions, in 2022. As indicated by a new market research study of Future Market Insights (FMI), nearly 70% of the demand for industrial electronics packaging is generated by industrial controls and power electronics.

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More than 90% of the overall industrial electronics packaging solutions are in the rigid format. Flexible packaging formats, although rapidly gaining ground across industries, holds a negligible share in packaging of industrial electronics.

Material-wise, plastics currently hold nearly 60% share in industrial electronics packaging materials and are likely to retain dominance in the global industrial electronics packaging market. The report opines that polyethylene (PE) will remain the most rewarding segment in the industrial electronics packaging market, followed by polyvinyl chloride (PVC), according to the report.

Asian Economies Hold Promising Investment Opportunities for Industrial Electronics Packaging Companies

North America is estimated to be the most prominent industrial electronics packaging market, the report also points to the robust growth in East Asia’s market attractiveness over the years to come. The East Asian market for industrial electronics packaging will thus remain a significant regional contender in the industrial electronics packaging landscape, according to FMI’s analysis.

In East Asia, Japan holds more than 50% of the market share, followed by China. South Asia is also cited as a highly lucrative investment pocket for manufacturers of industrial electronics packaging solutions, potentially outpacing other regional markets in terms of growth rate. Growth of South and East Asian market is attributed to robust manufacturing of consumer electronics and swelling demand for impact-resistant protective packaging solutions.

Europe is another prominent market for industrial electronics packaging, more than 60% of which is accounted by Germany. The country will continue to spearhead European market owing to towering rate of production of semiconductor components and equipment.

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Europe & the US Account for a Massive Share in Global Production of Industrial Electronics

Manufacturers of industrial electronics packaging are eyeing business expansion across countries with high consumer electronics production, as an effort to strengthen their foothold in the global industrial electronics packaging market. Leading manufacturers of industrial electronics packaging are either based out of the US or Europe, or have a strong presence in these regions, as both the markets hold a collective share of more than 60% in the global production of industrial electronics.

Industrial Electronics Packaging Industry Report Scope

AttributeDetails
Forecast Period2022-2029
Historical Data Available for2014-2021
Market AnalysisUS$ Mn for Value
Key Regions Covered
  • North America
  • Latin America
  • Europe
  • East Asia
  • South Asia & Pacific
  • Middle East & Africa (MEA)
Key Countries Covered
  • United States
  • Canada
  • Brazil
  • Mexico
  • Germany
  • U.K.
  • France
  • Spain
  • Italy
  • China
  • Japan
  • South Korea
  • India
  • Indonesia
  • Malaysia
  • Singapore
  • Australia
  • New Zealand
  • Turkey
  • South Africa
  • and GCC Countries
Key Market Segments Covered
  • Product Type
  • Material Type
  • Packaging Type
  • Region
Key Companies Profiled
  • DS Smith Plc.
  • Smurfit Kappa Group Plc.
  • UFP Technologies Inc.
  • Sealed Air Corporation
  • Achilles Corporation
  • Desco Industries Inc.
  • Botron Company Inc.
  • Kiva Container Corporation
  • Orlando Products Inc.
  • Delphon Industries LLC
  • Summit Container Corporation
  • Protective Packaging Corporation
  • Dou Yee Enterprises (S) Pte Ltd.
  • Dordan Manufacturing Company Inc.
  • GWP Group Limited
  • Pure-Stat Engineered Technologies Inc.
  • AUER Packaging GmbH
  • Emballages Cre-O-Pack International Inc.
  • Universal Protective Packaging Inc.

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About Packaging Division at Future Market Insights

The Packaging division at FMI provides an in-depth historical analysis and granular projections of the global packaging market. Ranging from packaging materials to designs & formats, FMI has an exhaustive market research database, serving clients with unique offerings and strategic recommendations. With a repository of 750+ reports, the team analyzed the packaging industry comprehensively in 70+ countries.

Explore FMI’s Extensive ongoing Coverage on Packaging Domain

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About Future Market Insights (FMI)

Future Market Insights (FMI) is a leading provider of market intelligence and consulting services, serving clients in over 150 countries. FMI is headquartered in Dubai, and has delivery centers in the UK, U.S. and India. FMI's latest market research reports and industry analysis help businesses navigate challenges and make critical decisions with confidence and clarity amidst breakneck competition. Our customized and syndicated market research reports deliver actionable insights that drive sustainable growth. A team of expert-led analysts at FMI continuously tracks emerging trends and events in a broad range of industries to ensure that our clients prepare for the evolving needs of their consumers.

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