ATP_Gen 4 M.2 2280 NVMe_pic3
ATP Electronics lanza SSDs 176-Layer PCIe® Gen 4 x4 M.2, U.2 industriales que ofrecen excelente rendimiento R/W y máxima capacidad de 7.68 TB
June 28, 2023 08:00 ET | ATP Electronics Taiwan Inc.
TAIPÉI, Taiwán, June 28, 2023 (GLOBE NEWSWIRE) -- ATP Electronics, el líder mundial en soluciones especializadas de almacenamiento y memoria, presenta sus más recientes unidades de...
ATP_Gen 4 M.2 2280 NVMe_pic3
ATP Electronics Meluncurkan SSD U.2 PCIe® Gen 4 x4 M.2 Industri 176-Layer yang Menawarkan Performa R/W yang Luar Biasa, dengan Kapasitas Tertinggi 7,68 TB
June 28, 2023 08:00 ET | ATP Electronics Taiwan Inc.
TAIPEI, Taiwan, June 28, 2023 (GLOBE NEWSWIRE) -- ATP Electronics, pemimpin global dalam solusi penyimpanan dan memori khusus, memperkenalkan solid state drive (SSD) berkecepatan tinggi Seri...
ATP_Gen 4 M.2 2280 NVMe_pic3
華騰國際科技發表工規176層 PCIe Gen 4x4 M.2與 U.2 系列固態硬碟, 提供高效讀/寫效能,7.68 TB 高容量記憶體產品
June 28, 2023 08:00 ET | ATP Electronics Taiwan Inc.
台灣台北, June 28, 2023 (GLOBE NEWSWIRE) -- 華騰國際科技(ATP Electronics) 為全球專注於儲存記憶體的領導廠商,推出最新高速N601 系列M.2 2280及U.2 固態硬碟(Solid State Drive, SSDs),與第四代 PCIe 介面相競速,支援NVMe 讀寫介面。新型華騰國際科技PCIe第四代固態硬碟,資料速度為16...
Global DRAM Module and Components Market
DRAM Module and Component Market by Type, End-user Industries, Memory and Geography - Global Forecast to 2027
May 09, 2022 07:03 ET | Research and Markets
Dublin, May 09, 2022 (GLOBE NEWSWIRE) -- The "DRAM Module and Component Market by Type (LPDRAM, DDR5, DDR4, DDR3, GDDR, HBM), End-User Industries (Server, Mobile Devices, Computers, Consumer...
Amid Adversity in NAND Supply, ATP Launches Additional 3D TLC Product Line with Ample Supply Support
Amid Adversity in NAND Supply, ATP Launches Additional 3D TLC Product Line with Ample Supply Support
March 18, 2022 11:00 ET | ATP Electronics Taiwan Inc.
TAIPEI, Taiwan, March 18, 2022 (GLOBE NEWSWIRE) -- ATP Electronics, the global leader in specialized storage and memory solutions, introduces its latest line of M.2 2280 NVMe solid state drives...
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Flash and XPoint Memory Applications and Market Forecasts to 2026 - End-use Markets, Shipments, Market Shares by Vendor, and More
September 30, 2021 05:23 ET | Research and Markets
Dublin, Sept. 30, 2021 (GLOBE NEWSWIRE) -- The "Flash and XPoint Memory Applications and Markets: 2019-2026" report has been added to ResearchAndMarkets.com's offering. Flash and XPoint memory...
ATP Electronics Thermal Management Memory Solution
ATP華騰國際發表高容量儲存記憶體 3.84及8 TB銅箔與鰭狀散熱片式NVMe M.2/U.2 固態硬碟
March 28, 2021 21:00 ET | ATP Electronics Taiwan Inc.
台灣台北, March 29, 2021 (GLOBE NEWSWIRE) -- 專注於儲存與記體體解決方案的領導廠商華騰國際科技(ATP Electronics)新發表客製化熱管理NVMe快閃記憶體解決方案。運用硬體與韌體配置,強化記憶體熱管理解決方案,特別針對NVMe介面的固態硬碟(Solid State Drives,...
ATP Electronics Thermal Management Memory Solution
ATP 推出铜箔、鳍型散热/导热片,用于 NVMe M.2/U.2 SSD,存储容量高达 3.84/8 TB
March 28, 2021 21:00 ET | ATP Electronics Taiwan Inc.
台北,台湾, March 29, 2021 (GLOBE NEWSWIRE) -- ATP电子,全球领先的专业存储和内存解决方案,宣布推出新的NVMe闪存及可定制的热管理解决方案。热管理解决方案同时使用硬件和固件组件,可防止过热,同时确保最佳的持续性能,尤其是对于 NVMe 固态硬盘 (SSD) 和模块,这些模块在安装在气流很少或根本没有气流的紧凑型系统中时,以飞快的速度运行。 ...
ATP Electronics Thermal Management Memory Solution
ATP présente le dissipateur thermique/tampon thermique à ailettes et feuille de cuivre pour les cartes SSD NVMe M.2/U.2 offrant jusqu'à 3,84/8 To de stockage
March 28, 2021 21:00 ET | ATP Electronics Taiwan Inc.
TAIPEI, Taïwan, 29 mars 2021 (GLOBE NEWSWIRE) -- ATP Electronics, le leader mondial des solutions spécialisées de stockage et de mémoire, a annoncé le lancement de ses nouvelles solutions de...
ATP Electronics Thermal Management Memory Solution
ATP Introduces Copper Foil, Fin-Type Heatsink / Thermal Pad for NVMe M.2/U.2 SSDs with up to 3.84/8 TB Storage
March 28, 2021 21:00 ET | ATP Electronics Taiwan Inc.
TAIPEI, Taiwan, March 28, 2021 (GLOBE NEWSWIRE) -- ATP Electronics, the global leader in specialized storage and memory solutions, announced the launch of its new NVMe flash storage solutions with...