SST and UMC Announce Qualification of Embedded SuperFlash® Technology on 40 nm CMOS Process
30 avr. 2018 08h00 HE
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Microchip Technology Inc
CHANDLER, Ariz., April 30, 2018 (GLOBE NEWSWIRE) -- The amount of data processed in Internet of Things (IoT) applications continues to increase, making low power and high density paramount to system...
Sidense Advanced Process Node 1T-OTP to Be Used in Sigma Designs DTV Products
29 oct. 2013 09h00 HE
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Sidense
OTTAWA, ON--(Marketwired - Oct 29, 2013) - Sidense Corp., a leading developer of Logic Non-Volatile Memory (LNVM) OTP IP cores, today announced that Sigma Designs®, a leading provider of...
Sidense Announces SHF 1T-OTP Non-Volatile Memory IP for Advanced Process Chip Designs
31 juil. 2013 09h00 HE
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Sidense
OTTAWA--(Marketwired - Jul 31, 2013) - Sidense Corp., a leading developer of Logic Non-Volatile Memory (LNVM) OTP IP cores, today announced its SHF (Sidense Hiper Fuse) one-time programmable (OTP)...
STATS ChipPAC Completes Expansion of 300mm Wafer Bump and WLCSP Operation in Taiwan
16 nov. 2011 23h00 HE
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STATS ChipPAC
SINGAPORE--11/17/2011, UNITED STATES--(Marketwire - Nov 16, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...