DES PLAINES, Ill., June 17, 2002 -- Northrop Grumman Corporation (NYSE:NOC) today announced the introduction of HydroMark 531 water-soluble solder paste by Kester, a business unit of Northrop Grumman's Component Technologies sector.
Kester's HydroMark 531 was introduced in response to the market's increasing demand for an all-purpose, reliably consistent water-soluble solder paste that provides hours of stable stencil life, tack time and printing characteristics.
Kester's HydroMark 531 offers much improved anti-slump characteristics along with excellent solderability to a wide range of surface and component lead metallizations, solving problems caused by slumping, bridging and wetting.
For more information on HydroMark 531 and Kester's full line of products and services, contact Kester by phone at (847) 297-1600 or 800-2-KESTER (53-7837), by fax at (847) 699-5548, or by e-mail at customerservice@kester.com. Kester's Web site can be found at www.kester.com.
Founded in 1899, Kester is a world-renowned supplier of solder and related materials and services to the electronic assembly and micro-component markets. It is known for high quality, advanced technology and superior technical support. Kester's headquarters is located in Des Plaines, Ill., with additional manufacturing facilities in the United States, Canada, Singapore, Germany, Japan, Brazil, Taiwan, the Philippines, and Malaysia. Its worldwide manufacturing and technical capabilities provide the support required to serve major Electronic Manufacturing Service and Original Equipment Manufacturers.
Northrop Grumman's Component Technologies sector, headquartered in Iselin, N.J., is a world leader in the design, development and manufacture of high-performance electronic and optical components and materials to the telecommunications, networking, industrial, medical and military markets. Component Technologies includes Interconnect Technologies, Kester, Life Support, Poly-Scientific, Precision Products International, VEAM and Winchester Electronics.
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