WALLINGFORD, Conn., June 2, 2003 (PRIMEZONE) -- Northrop Grumman Corporation (NYSE:NOC) today announced that Winchester Electronics, a business unit of the Component Technologies sector, will be participating in the Optical Internetworking Forum (OIF) Physical and Link Layer demonstration at SUPERCOMM 2003 in Atlanta, June 1-5. Winchester, an OIF member, will be demonstrating 10Gbps serial data transmission in a backplane environment using its SIP1000 I-Platform(tm) passive interconnect technology.
"The OIF's is pioneering interoperability standards for high-speed data transmission in copper. This is vitally important as it is setting technology direction, and enabling suppliers of disparate, but interdependent, technologies to develop a mutual understanding of the technical issues that each faces in developing solutions," said Douglas Hynd, director of Technical Marketing. "We have found this to be of particular importance in developing solutions for the CEI 11G LR standard for backplane applications since it is clear that, in the future, it will be necessary for transceiver and interconnect suppliers to work together to specify the interoperability of their products at the channel level."
"Developing solutions for 11 Gbps backplane data transmission requires a deep understanding of all causes of power loss and noise in the passive transmission channel. That means a connector supplier can no longer be content to specify connector performance in terms of a standalone connector," said John Mitchell, senior applications engineer. "For 11Gbps applications, interconnect performance must be specified for the entire channel, consisting of six vias, three PCB traces, and two connectors."
Douglas Hynd's paper, "Optimizing Passive Channel Performance for 11G CEI," describes how channel loss and noise in 10Gbps transmission channels can be minimized through the adoption of new connector architectures, while Mitchell's paper, "Characterizing 11G Long Reach CEI Channels," proposes a methodology for specifying 10Gbps passive channel performance.
The OIF will be sponsoring a Physical and Link Layer (PLL) Interoperability Demonstration at SUPERCOMM 2003 in Booth #10205, Hall C. The live SUPERDemo will feature a visual representation of dynamic N-way interoperability of the SPI-4.2 Implementation Agreement (IA), SFI-4IA and the tunable laser IA among OIF member companies. The OIF will also be introducing its new project, CEI, with demonstrations of electrical interfaces with signaling rates of 6+ and 11+ GBaud for chip-to-chip, chip-to-optical module and electrical backplane applications. Winchester Electronics will be demonstrating 10Gbps active data transmission over 34 inches of FR4 backplane, and passive data transmission over 26 inches of Rogers 4350(r) backplane using the revolutionary SIP1000 I-Platform(tm) technology. The active SIP1000 I-Platform(tm) will be available at the OIF booth where both Hynd and Mitchell will be giving technical presentations. A demonstration of a passive SIP1000 I-Platform(tm) will be available at Winchester's Booth #11831 -- Hall C3.
OIF is a growing non-profit organization with 250+ member companies to date, including many of the world's leading carriers, component and system vendors. The purpose of the OIF is to accelerate the deployment of interoperable, cost effective, and robust optical internetworks and their associated technologies. More information on the OIF and the interoperability demonstration can be found at www.oiforum.com.
Winchester Electronics is a premier provider of high-speed, high-bandwidth interconnect products, including board-to-board connectors, RF connectors, cable assemblies, and power interconnects to the telecommunications, electronics and information technology industries. Winchester supports the specific needs of its customers globally with technical Centers of Excellence in Connecticut, Mexico, China and Malaysia.
Northrop Grumman's Component Technologies sector, headquartered in Iselin, N.J., is a world leader in the design, development and manufacture of high-performance electronic and optical components and materials to the telecommunications, networking, industrial, medical and military markets. Component Technologies includes Winchester Electronics, Interconnect Technologies, Kester, Life Support, Poly-Scientific and Precision Products International.
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