BILTHOVEN, The Netherlands, August 25, 2003 (PRIMEZONE) -- ASM International N.V. (Nasdaq:ASMI) (Euronext Amsterdam:ASM) announced today that it intends to enter into a long-term co-operative agreement with the University of Helsinki to jointly pursue further development of Atomic Layer Deposition (ALD) technology. As part of this agreement, ASM intends to relocate its Espoo, Finland, research and development activities to the nearby campus of the University of Helsinki, Finland.
Atomic Layer Deposition is an advanced technology that deposits single atomic layers on semiconductor wafers one at a time at low temperatures. The process is used to create ultra-thin films of exceptional quality and flatness. Through its Microchemistry subsidiary, ASM has pioneered development of ALD applications for the semiconductor industry. The University of Helsinki is one of the world's leading academic research institutes active in the field of ALD.
The co-operation is scheduled to take full effect in November 2003. Pending completion of the necessary procedures with the employees and the co-operation agreement with the University, it will involve the deployment of equipment and about 10 to 15 ASM Microchemistry scientists and engineers at the University campus. The Microchemistry subsidiary will continue to be committed to the development of new ALD applications for the semiconductor industry, and the transfer of these processes to other ASM subsidiaries for commercialization.
At the same time, ASM announces the completion of the move to locate substantially all operations of its Polygon ALCVD product-line in the USA. ASM had previously relocated manufacturing and part of the engineering of that product-line in the USA. This will result in a reduction of the Finnish subsidiary by about 20 to 25 people, and is part of earlier announced restructuring plans of ASM's Front-end Operations.
The co-operation will allow ASM and the University to combine forces on ALD research, and develop very advanced ALD processes. "By working closely with one of the world's leading ALD academic research institutes, we expect to be able to move ahead faster in developing and commercializing the applications roadmap for ALD," said Ivo Raaijmakers, Chief Technology Officer of ASM International's Front-end Operations. Markku Leskela, Professor of Inorganic Chemistry at the University of Helsinki added, "Although we regret the reduction in size of ASM Microchemistry, nearly doubling ALD researchers and reactors in our premises is a great opportunity for a fruitful co-operation." He continued, "We can now do everything from precursor design to initial manufacturing scale-up, which will increase speed and chances of technology adoption in the industry."
About ASM
ASM International N.V. is headquartered in Bilthoven, the Netherlands. ASM International is a global company, serving one of the most important and demanding industries in the world. The Company possesses a strong technological base, state-of-the-art manufacturing facilities, a competent and qualified workforce and a highly trained, strategically distributed support network. ASM International's subsidiaries design and manufacture equipment and materials used to produce semiconductor devices. ASM International and its subsidiaries provide production solutions for wafer processing, assembly and packaging through their facilities in the United States, Europe, Japan and Asia. ASM International's common stock shares trade on Nasdaq (symbol ASMI) and the Euronext Stock Exchange in Amsterdam(symbol ASM). For more information, visit ASM's web site at http://www.asm.com
Safe Harbor Statement under the US Private Securities Litigation Reform Act of 1995: The statements regarding orders, earnings development and the effects of research and new products on ASM's future, and other matters discussed in this statement, except for any historical data, are forward-looking statements. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those in the forward-looking statements. These include, but are not limited to economic conditions in the semiconductor industry, currency fluctuations, the timing of significant orders, market acceptance of new products, competitive factors, risk factors related to litigation and other risks indicated in filings from time to time with the SEC and Stock Exchange Authorities.
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