ASM Receives Order for BGA Packaging Systems from Major North American Semiconductor Manufacturer


BILTHOVEN, The Netherlands, Oct. 17, 2003 (PRIMEZONE) -- ASM International N.V. (Nasdaq:ASMI) (Euronext Amsterdam:ASM) announced that its 54%-owned subsidiary, ASM Pacific Technology, Ltd. (Hong Kong Exchanges: 0522) has received an initial order for multiple ASM BP 209 solder ball placement systems from one of the world's top semiconductor manufacturers. The custom-built systems begin delivery immediately and will be installed at several of the customer's global locations. Patrick Lam, managing director of ASM Pacific Technology, Ltd. stated, "The selection of ASM as global supplier for solder ball placement by this prestigious chip company came after extensive competitive analysis. Our proprietary pick head design and vision system showed superior technology for fast and accurate processing during evaluation. In particular, the fine pitch capability of our ball placement system, capable of 0.2mm ball and 0.4mm pitch proved to be superior in both yield and productivity". The BP 209 solder ball placement system is used to place solder balls on chip scale and ball grid array (BGA) semiconductor packages, connecting the chip with the circuit board.

About ASM and ASMPT

ASM International N.V. is headquartered in Bilthoven, the Netherlands. ASM International is a global company, serving one of the most important and demanding industries in the world. The Company possesses a strong technological base, state-of-the-art manufacturing facilities, a competent and qualified workforce and a highly trained, strategically distributed support network. ASM International's subsidiaries design and manufacture equipment and materials used to produce semiconductor devices. ASM International and its subsidiaries provide production solutions for wafer processing, assembly and packaging through their facilities in the United States, Europe, Japan and Asia. ASM International's common stock shares trade on Nasdaq (symbol ASMI) and the Euronext Stock Exchange in Amsterdam (symbol ASM). For more information, visit ASM's web site at http://www.asm.com

ASM Pacific Technology, Ltd. with headquarters in Hong Kong, has operations in Shenzhen China, Singapore and Malaysia. It is the world's largest supplier of a full line of assembly and packaging equipment for the semiconductor industry. It also supplies the Photonics and Optoelectronics markets. With its financial strength and R&D resources, ASMPT offers its customers total solutions in process innovations, package development and factory automation. ASMPT is 54%-owned by ASM International N.V. ASM Pacific Technology, Ltd. common shares trade on the Hong Kong Exchanges under the symbol: 0522. For more information, visit ASMPT's web site at www.asmpacific.com

Safe Harbor Statement under the US Private Securities Litigation Reform Act of 1995: The matters discussed in this statement, except for any historical data, are forward-looking statements. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those in the forward-looking statements. These include, but are not limited to economic conditions in the semiconductor industry, currency fluctuations, the timing of significant orders, market acceptance of new products, competitive factors, risk factors related to litigation and other risks indicated in filings from time to time with the SEC and Stock Exchange Authorities.

ASM is a trademark of ASM International N.V.

http://hugin.info/132090/R/920954/124132.pdf

Contact:


 Jerry Dellheim VP Strategic Marketing 
 ASM Pacific Technology, Ltd.
  + 1 408 451 0804

 Mary Jo Dieckhaus US Investor Relations 
 ASM International N.V.
  +1 212 986 2900