EMCORE Announces Small Form Factor CX4 for 10GbE Transmission Over Copper


SOMERSET, N.J., April 13, 2005 (PRIMEZONE) -- EMCORE Corporation (Nasdaq:EMKR), a leading provider of compound semiconductor-based components and subsystems for the broadband, fiber optic, satellite, and wireless communications markets, today introduces its PCI height compliant, small form factor 10GBASE-CX4 (CX4) module, which extends its portfolio of electrical domain products for the 10 Gigabit Ethernet (10GbE) market. This product offers 10GbE connectivity over electrical cables in an 11mm high X2 package. The CX4 module fully complies with the IEEE 802.3ak standard, X2 package multi-source agreement, and PCI card height requirements enabling new 10 gigabit enterprise data center, server and network attached storage connections. EMCORE's CX4 module also provides an integrated media detect function, which provides compatibility with EMCORE's SmartLink(tm) optical media converter, extending the transmission distance up to 300m. The new reduced-size X2 module is roughly half the size of the XENPAK units and supports topside mounting on the host PCB.

Charles Wang, Director of Module Development for EMCORE's Fiber Optics Division, said, "We are seeing broad industry wide expansion of 10 Gigabit Ethernet. As the breadth and depth of systems expand, EMCORE continues to provide products which address the market's need for innovative pluggable devices. EMCORE's new CX4 units provide a robust, cost effective solution which compliments our other 10GbE electrical and optical XENPAK and X2 options."

"Falling prices are key to the growth we expect in 10GbE NIC and iSCSI HBA shipments during 2005 and 2006," said Bob Wheeler, Senior Analyst at The Linley Group. "As a lower cost alternative to fiber, CX4 is helping to enable data center deployments of 10GbE in servers, switches, and IP-storage systems."

EMCORE's CX4 transceiver provides 10GbE connectivity over standard electrical cables for distances up to 15m. As with all of EMCORE's X2 products, this module provides full diagnostic, monitoring and control functions through the IEEE standard Management Data Input Output (MDIO) interface. The MDIO interface may be programmed with customer specific data to provide additional vendor control of modular interfaces in their system environment. This X2 module is available in PCI-height (11mm) and mid-height (13.46mm) versions.

Together, EMCORE's CX4, LX4 and EX4 modules, in XENPAK and X2 form factors, support 10GbE over the full range of Data Center, Workgroup, Enterprise, Campus and Metropolitan Area Networks, offering a distance range at 10-gigabit speeds from 1m to 40km. Pluggable X2 and XENPAK form factors enable a "Pay-as-You-Populate" cost structure during installation. Modular interconnects, such as X2 and XENPAK, are inserted into pluggable port slots in switches, routers, servers or storage systems.

About EMCORE

EMCORE Corporation offers a broad portfolio of compound semiconductor-based components and subsystems for the broadband, fiber optic, satellite, and wireless communications markets. The company's integrated solutions philosophy embodies state-of-the-art technology, material science expertise, and a shared vision of our customer's goals and objectives to be leaders in the transport of voice, data, and video over copper, hybrid fiber/coax (HFC), fiber, satellite, and wireless networks. EMCORE's solutions include: optical components and subsystems for fiber-to-the-premise, cable television, and high speed data and telecommunications networks; solar cells, solar panels, and fiber optic ground station links for global satellite communications; and electronic materials for high bandwidth wireless communications systems, such as Wi-Fi Internet access and cell phones. Through its joint venture participation in GELcore, LLC, EMCORE plays a vital role in developing and commercializing next-generation High-Brightness LED technology for use in the general and specialty illumination markets. For further information about EMCORE, visit http://www.emcore.com.

The information provided herein may include forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Such forward-looking statements include, but are not limited to, any statement or implication that the products described in this press release (i) will be successfully introduced or marketed, (ii) will be qualified and purchased by our customers, or (iii) will perform to any particular specifications or performance or reliability standards. Such forward-looking statements involve risks and uncertainties that, if realized, could materially impair the Company's results of operations, business, and financial condition. These risks and uncertainties include, but are not limited to, (a) the failure of the products (i) to perform as expected without material defects, (ii) to be manufactured at acceptable volumes, yields, and cost, (iii) to be qualified and accepted by our customers, and (iv) to successfully compete with products offered by our competitors, and (b) factors discussed from time to time in reports filed by the Company with the Securities and Exchange Commission. The forward-looking statements contained in this news release are made as of the date hereof and EMCORE does not assume any obligation to update the reasons why actual results could differ materially from those projected in the forward-looking statements.



            

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