IRVINE, Calif., June 7, 2005 (PRIMEZONE) -- Microsemi Corporation (Nasdaq:MSCC), a leading manufacturer of high reliability discrete semiconductors for the MRI clinical market and advanced analog and mixed signal integrated circuits, announced today that it has developed the industry's lowest magnetic distortion PIN diode for "In Bore" surface coil magnetic resonance applications.
-- Breakthrough virtually eliminates magnetic field
distortion
-- Newest surface coil switching device expected to elevate
industry standard--again
-- RoHS Compliant
Designated the UMX5601(tm), Microsemi's new device has already been recommended by leading manufacturers of MRI high magnetic field systems having magnets of 3 Telsa strength or greater. These PIN diodes produce the lowest magnetic field distortion (artifacts) in the industry today.
Artifact interference is created by a "glow" or "halo" surrounding a diode's structure. The greater the artifact, the more difficult it becomes to accurately measure the location of objects, such as tumors, being scanned by the imager's RF magnetic field. The UMX5601(tm) will significantly enhance the diagnosis accuracy for current clinical applications as well as future machines of strength greater than 1.5 Telsa.
"Microsemi has a solid reputation for high reliability semiconductors used in medical and aerospace applications. The MRI market continues to expand at greater than 18% and Microsemi intends to continue to focus innovative products for this growing market," said James J. Peterson, Microsemi President and CEO.
"This latest Microsemi breakthrough once again sets the standard for high performance MRI surface coils," said John Caruso, VP and General Manager of the company's Lowell, Massachusetts, operation. "It follows on the heels of our successful UM9995(tm) diode, which also was a performance breakthrough and continues to be designed into many MRI systems," he added.
Like its predecessor, the UMX5601(tm)'s superior performance results from a combination of innovative thermally matched packaging, low inductance Microsemi PIN diode silicon chips, and a proprietary construction process that uses full-faced metallurgical bonds to both surfaces of the chip. The device provides high power handling capability with a lower bias current requirement.
Complete technical information is available on the Microsemi web site, http://www.Microsemi.com. Samples can be requested through this site, from Microsemi sales representatives, or from Microsemi in Lowell at 978-442-5600.
About Microsemi Corporation
Microsemi is a leading designer, manufacturer and marketer of high performance analog and mixed signal integrated circuits and high reliability semiconductors. The company's semiconductors manage and control or regulate power, protect against transient voltage spikes and transmit, receive and amplify signals.
Microsemi's products include individual components as well as integrated circuit solutions that enhance customer designs by improving performance and reliability, battery optimization, reducing size or protecting circuits. The principal markets the company serves included implanted medical, defense/aerospace and satellite, notebook computers, monitors and LCD TVs, automotive and mobile connectivity applications. More information may be obtained by contacting the company directly or by visiting its web site at http://www.microsemi.com.
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Investor Inquiries: David R. Sonksen, Microsemi Corporation, Irvine, CA (949) 221-7101.