BILTHOVEN, Netherlands, July 07, 2005 (PRIMEZONE) -- ASM International N.V. (NASDAQ:ASMI) (Euronext Amsterdam:ASM) will host technology seminars for customers, and members of the financial community and media, in conjunction with Semicon West, on Wednesday, July 13, 2005, in Room 113, North Hall, at the Moscone Convention Center, 747 Howard Street, San Francisco, CA.
The investor technology presentation will be held from 8:00 to 9:30 a.m. Pacific Time and will also be web cast on www.asm.com. Dr. Ivo Raaijmakers, Chief Technology Officer and Director of Research and Development for ASM's Front-end semiconductor equipment operations, and Charles J. Vath III, VicePresident, Process & Packaging Technology, for ASM Pacific Technology, Ltd. will be the speakers.
Presentations on specific Front-end technologies will commence at 10:30 a.m. and continue to 1:00 p.m. Pacific Time. The seminar topics include: New ArF litho hardmask with Nano Carbon Polymer (NCP) technology; ULK and low-k SiC for 45nm technology; Planar copper for interconnects; Low resistivity TiN in batch processing; Emissivity independent RTP processing; PEALD for advanced DRAM, eDRAM, RF linear and decoupling capacitors; and Strained silicon for future high-mobility gate channels.
A third seminar dedicated to Planar copper for interconnects will be held on Wednesday, July 13 & Thursday, July 14, 2005, from 12:00 to 2:30 p.m. Pacific Time at The Palace Hotel, Sea Cliff Room, 2 MontgomeryStreet, San Francisco, CA.
To attend the investor seminar, reply to maryjo.dieckhaus@asm.com. To reserve for all other seminars, reply to loretta.liggett@asm.com by July 8 and indicate attendance at the Moscone Center sessions and/or the dedicated planar-copper seminar at The Palace Hotel (Wednesday orThursday). Semicon West attendees are invited to visit ASM International'sbooth No. 614, South Hall, and the ASM Pacific Technology booth No. 7129, West Hall, at the Moscone Convention Center, July 12 - 14, 2005.
About ASM and ASMPT
ASM International N.V. and its subsidiaries design and manufacture equipment and materials used to produce semiconductor devices. The company provides production solutions for wafer processing (Front-end segment) as well as assembly and packaging (Back-end segment) through facilities in the United States, Europe, Japan and Asia. ASM International's common stock trades on NASDAQ (symbol ASMI) and the Euronext Amsterdam Stock Exchange (symbol ASM). For more information, visit ASMI's web site at www.asm.com.
ASM Pacific Technology, Ltd. with headquarters in Hong Kong, has operations in Shenzhen China, Singapore and Malaysia. It is the world's largest supplier of a full line of assembly and packaging equipment for the semiconductor industry. It also supplies the Photonics and Optoelectronics markets. With its financial strength and R&D resources, ASMPT offers its customers total solutions in process innovations, package development and factory automation. ASMPT is 54%-owned by ASM International N.V. ASM Pacific Technology, Ltd. common shares trade on the Hong Kong Exchanges under the symbol: 0522. For more information, visit ASMPT's web site at www.asmpacific.com
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