SCOTTS VALLEY, Calif., Sept. 13, 2005 (PRIMEZONE) -- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that Mr. M.H. Toh recently joined the company as General Manager of the Carsem S-Site factory. He reports to Carsem's Chief Operating Officer, Mr. S.W. Woo, and is replacing the former General Manager, Mr. Alex Khor, who retired in June this year.
Mr.Toh has over 25 years of experience in the semiconductor industry with an extensive background in both the assembly and test operations. He has held various management positions in production, quality assurance and process engineering. Prior to joining Carsem, he was the Assembly Operations Director for National Semiconductor in Melaka, Malaysia.
S.W. Woo stated, "I am very pleased to have M.H. join our company. His broad-based experience in both the assembly and final test operations, including a hands-on experience in a wide range of packaging technologies, will provide new dynamics to Carsem's growth."
"I am very pleased to join the Carsem team and look forward to helping with the company's continued success as one of the world leaders in contract assembly and test services," stated Mr. Toh.
About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry and offers one of the widest ranges of package and test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the U.S., plus the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.