IRVINE, Calif., Nov. 14, 2006 (PRIMEZONE) -- Microsemi Corporation (Nasdaq:MSCC), a leading manufacturer of high reliability semiconductors, has announced breakthrough surface mount packaging for high power transient voltage suppression (TVS) devices used to protect electronic circuitry in a wide range of applications found in aircraft, automotive and industrial products.
-- Handles up to 30 kilowatt TVS devices -- Eliminates through-hole assembly in high power applications -- Provides economical tape and reel automated assembly -- Space saving low profile design
Designated PLAD, for Plastic Large Area Devices, the new Microsemi surface mount packages are also suited for 15-200 volt, 150 amp Schottky diodes and 10-1000 volt 200 amp rectifier diodes, components previously available only in more costly through-hole designs.
The patent-pending PLAD design is the latest component packaging innovation from Microsemi that includes patented Powermite(r) surface mount for low power devices, CoolPack, Thinkey and hermetic power modules.
PLAD 15kW devices measure less than 10mm square by 2.54mm high, with 30kW devices measuring only 12.57mm square by 3.30mm high. Devices can be screened for high-rel commercial aviation and heavy industrial applications and can be supplied RoHS compliant, e3.
Design features include no wire bonds, very low thermal resistance of less than 0.20C/W, very low package inductance and the use of internal materials having matched CTE specifications for reliable temperature cycling operation.
Microsemi's initial offerings in the new PLAD package include 104 TVS devices rated at 15kW and 88 rated at 30kW.
Complete technical information is available on the Microsemi web site, www.microsemi.com. Samples can be requested through this site, from Microsemi sales representatives, or through Microsemi's distribution channel.
About Microsemi Corporation
Microsemi is a leading designer, manufacturer and marketer of high performance analog and mixed signal integrated circuits and high reliability semiconductors. The company's semiconductors manage and control or regulate power, protect against transient voltage spikes and transmit, receive and amplify signals.
Microsemi's products include individual components as well as integrated circuit solutions that enhance customer designs by improving performance and reliability, battery optimization, reducing size or protecting circuits. The principal markets the company serves included implanted medical, defense/aerospace and satellite, notebook computers, monitors and LCD TVs, automotive and mobile connectivity applications. More information may be obtained by contacting the company directly or by visiting its web site at http://www.microsemi.com
The Microsemi Corporation logo is available at http://www.primezone.com/newsroom/prs/?pkgid=1233
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Investor Inquiries: David R. Sonksen, Microsemi Corporation, Irvine, CA (949) 221-7101.