Telelogic Signs 776,684 USD Contract with World Leader in Semiconductor Assembly Equipment


Telelogic Signs 776,684 USD Contract with World Leader in Semiconductor Assembly
Equipment

MALMÖ, Sweden and IRVINE, California -September 21, 2007 - Telelogic (Nordic
Exchange/MidCap/TLOG) today announced that it has signed a 776,684 USD agreement
with a world leader in semiconductor assembly equipment. The agreement includes
license, maintenance and professional service.
The company, an existing user of Telelogic Rhapsody®, the leading Model Driven
Development (MDD) environment for embedded and real time systems and software
applications, has extended the current usage to incorporate additional
divisions.
“Telelogic is very pleased to see not only yet another large global organization
extending their usage of Telelogic's solutions, but also continued success for
Rhapsody as part of Telelogic,” said Anders Lidbeck, president and CEO of
Telelogic. “This is another industry vote of confidence in our ability to
deliver in the most demanding of environments.”

About Telelogic
Telelogic is the leading global provider of software solutions for Enterprise
Lifecycle Management (ELM). Award-winning Telelogic software helps customers
design, develop, and deliver the world's most advanced and innovative products,
systems, and software more efficiently by aligning and optimizing development
lifecycles and business processes with business objectives and customer needs.
Telelogic helps customers improve quality and predictability while reducing
time-to-market and overall costs. Headquartered in Malmö, Sweden with U.S
headquarters in Irvine, California, Telelogic conducts business in more than 40
countries. More than one third of the Fortune Global 500 companies use Telelogic
software including marketing-leading aero/defense, automotive, financial
services, software/electronic and telecommunications companies and governments
worldwide. For more information, see www.telelogic.com. 

Corporate Communications Contact:

Catharina Paulcén, 
EVP Corporate Communications
+46 (40) 17 47 30

Attachments

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