STI to Present At IWPC-Sponsored Conference October 18, 2007


SANTA BARBARA, Calif., Oct. 10, 2007 (PRIME NEWSWIRE) -- Superconductor Technologies Inc. (STI) (Nasdaq:SCON), a leading provider of high performance infrastructure products for wireless voice and data applications, today announced Dr. Robert B. Hammond, chief technical officer and senior vice president, is scheduled to present at the International Wireless Industry Consortium (IWPC) Technology Exchange Forum to be held at the Kongresshotel Europe in Stuttgart, Germany on October 18, 2007.

The forum, titled "WiMAX, LTE and UMB Infrastructure - RF Technology Challenges and Comparisons," is being hosted by Alcatel-Lucent. The number of options for delivery of wireless mobile services has been increasing over the last several years and this event will focus on the emerging requirements for Worldwide Interoperability for Microwave Access (WiMAX), Long Term Evolution (LTE), Ultra Mobile Broadband (UMB) and Orthogonal Frequency-Division Multiplexing (OFDM) based systems and networks. The forum will explore the new semiconductor and subsystem technologies emerging to address the demands made on the RF systems and subsystems by these new delivery options.

Dr. Hammond's presentation on October 18th is titled "Reconfigurable Filters for Emerging Interference Challenges." The presentation will focus on the reconfigurable filter requirements for the evolving complexity of adding multiple technologies in a common spectrum.

About IWPC

The IWPC is a pro-active international community of wireless and RF product OEMs and their suppliers. Its mission is to facilitate communication up and down the entire supply chain to: identify and clarify markets, products/service opportunities; reduce costs; improve performance; and decrease time to market for all things wireless. More information can be found at http://www.iwpc.org.

About Superconductor Technologies Inc. (STI)

STI, headquartered in Santa Barbara, CA, is a leading provider of high performance infrastructure products for wireless voice and data applications. STI's SuperLink(r) solution increases capacity utilization, lowers dropped and blocked calls, extends coverage, and enables faster wireless data rates. Its AmpLink(tm) solution enhances the performance of wireless base stations by improving receiver sensitivity and geographic coverage.

For information about STI, please visit http://www.suptech.com.

The Superconductor Technologies Inc. logo is available at http://www.primenewswire.com/newsroom/prs/?pkgid=3963



            

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