SAN JOSE, Calif., Jan. 4, 2008 (PRIME NEWSWIRE) -- Electroglas, Inc. (Nasdaq:EGLS), a leading supplier of wafer probing and software solutions for the semiconductor industry, today announced that they have been rewarded a patent for its' proprietary Active Vibration Cancellation (AVC) hardware and related software algorithms.
As device metrologies continue to shrink, the accurate and stable application of test contactor to device bond pad becomes even more critical. External, as well as internal vibrations and disturbances routinely cause poor contact and result in test failures and bonding pad damage. The result is not only unstable electrical contact resistance between the test contactor and the bond pad but device damage as well due to excessive bond pad scrub caused by these vibrations.
When using the Active Vibration Cancellation feature on the EG6000 wafer prober our customers are realizing higher sort yields due to the stabilization of contact resistance during the wafer sort process. The device electrical contact is maintained even in a "less than perfect" raised floor environment where tool to tool vibrations are an inherent problem and subsequently a cause of yield loss and bond pad damage. An added result of using AVC is in capital cost as customers can reduce the cost of test floor investments through reductions in vibration isolation infrastructures that are employed with other probing equipment.
Electroglas, Inc., with the issuance of the AVC patent, has also begun to partner with other Semiconductor suppliers to provide its' AVC control system in applications where precise control of motion system to work-piece is required. There are a large number of MEMS assembly and Inspection applications that are now requiring a higher degree of accuracy and control as we move further into the nano age. Electroglas is uniquely positioned to supply this emerging industry with fast, accurate and cost effective positioning systems through the use of Active Vibration Cancellation technology.
Rick Casler, Electroglas, CTO states, "This patent approval for AVC is a significant reward for Electroglas Inc. and solidifies our technological leadership in the wafer probing arena in addition to opening up opportunities to grow this new and advanced technology."
About Electroglas
Electroglas is a leading supplier of wafer probers and software solutions and services for the semiconductor industry. For more than 40 years, Electroglas has helped integrated device manufacturers (IDMs), wafer foundries and outsourced assembly and test (OSAT) suppliers improve the overall effectiveness of semiconductor manufacturers' wafer testing. Headquartered in San Jose, California, with offices throughout the world, Electroglas has shipped more than 16,500 systems worldwide. Electroglas' stock trades on the NASDAQ Global Market under the symbol "EGLS." Additional information about Electroglas is available at www.electroglas.com.