SCANFIL PLC 3 APRIL 2008 3.50 P.M. SCANFIL PLC'S ANNUAL GENERAL MEETING, 3 APRIL 2008 Scanfil plc's Annual General Meeting has in it's meeting on 3 April 2008 confirmed the Financial Statements for 2007 and discharged the Board of Directors and the President from liability. According to Board of Directors' proposal The Annual General Meeting decided to distribute a dividend of EUR 0.12 per share, or a total of EUR 7,045,898.52. The record date for the payment of dividend is 8 April 2008 and the date of payment of the dividend is 15 April 2008. The Meeting resolved that the Board of Directors consists of five members. Asa-Matti Lyytinen, Jorma J. Takanen, Reijo Pöllä, Jarkko Takanen and Tuomo Lähdesmäki were re-elected as members of the Board of Directors. In it's meeting, held after the General Meeting, the Board of Directors elected Jorma J. Takanen as the Chairman of the Board of Directors and Asa-Matti Lyytinen as Vice Chairman of the Board of Directors. The Meeting decided according to the Board of Directors' proposal to authorize the Board of Directors to decide on the acquisition of the Company's own shares with distributable assets. The Meeting approved the Board of Directors' proposal to split up the company with a business transfer to an investment company Scanfil plc and sub-concern Scanfil EMS Oy practicing contract manufacturing business. The meeting authorised the Board to decide on all required measures to execute and implement the business transfer. The Meeting approved the Board of Directors' proposal to amend the Articles of Association. SCANFIL PLC Harri Takanen President Additional information President Harri Takanen, tel +358 8 4882 111 DISTIBUTION Helsinki Exchanges Major Media www.scanfil.com Scanfil plc is a global contract manufacturer and systems supplier for communication and industrial electronics with over 30 years experience in demanding contract manufacturing Scanfil offers contract-manufacturing services as a systems supplier to the telecommunication industry, mainly to wireless communication sector, as well as to the industrial electronics industry. Main telecommunication products are among others integrated enclosure systems for mobile phone and ADSL networks and assembly and testing of modules related to enclosure systems. Examples of industrial electronics products include box-built tested devices, various electronic modules, backplanes and assembled circuit boards as well as cable assemblies. Production plants are situated in China, Hungary, Estonia and Finland.