Entegris' Newest Wafer Handling Products Support Industry Move to Next-Generation Processing

Displays Prototypes of 450mm Wafer Carriers and Shippers and 300mm Prime Small-Lot FOUP


SAN FRANCISCO, July 15, 2008 (PRIME NEWSWIRE) -- Entegris, Inc. (Nasdaq:ENTG) unveiled several new advanced wafer handling products at the SEMICON West 2008 trade show held in San Francisco, July 15-17. The products support the industry's move to next-generation wafer processing including 450mm wafers and lower capacity 300mm wafer carriers that improve the utilization of process materials, equipment and overall fab throughput.

Entegris displayed a complete set of solutions for handling 450mm wafers that include prototypes of a 25-wafer capacity 450mm fab carrier as well as multiple wafer and single wafer 450mm shippers. To address the challenges of "wafer sag," and automated wafer handling at 10mm pitch, Entegris has developed two wafer support designs, one supporting the wafer at its perimeter and another using a cantilever design that supports the wafer with back side surface contact.

"Delivery of advanced solutions for protecting and transporting wafers and reticles requires significant materials science expertise," said Bill Shaner, vice president and general manager, Microenvironments, Entegris. "It is our unique ability to pair that expertise in innovative product design with polymer engineering and materials science that allows us to help our customers enhance their yields and improve performance in next-generation wafer processing."

Entegris also introduced a beta version of a two-wafer small-lot FOUP (front opening unified pod) which supports the 300mm Prime work-flow initiative being developed jointly by fabs and manufacturers of automated wafer handling systems to optimize work flow and reduce cycle times. The small-lot FOUP features advanced microenvironment sealing technology that reduces particle contamination and simplifies door closure and opening, leading to greater load-port efficiency and reliability. In addition, users can stack three small-lot FOUPs in the same footprint as one existing 300mm FOUP, thus saving precious fab space and improving manufacturing efficiencies.

For more information, visit Entegris at SEMICON West 2008, booth 1021 in the South Hall of the Moscone Center.

About Entegris

Entegris is a leading provider of a wide range of products for purifying, protecting and transporting critical materials used in processing and manufacturing in the semiconductor and other high-tech industries. Entegris is ISO 9001 certified and has manufacturing, customer service and/or research facilities in the United States, China, France, Germany, India, Israel, Japan, Malaysia, Singapore, South Korea and Taiwan. Additional information can be found at www.entegris.com.

The Entegris, Inc. logo is available at http://www.primenewswire.com/newsroom/prs/?pkgid=5231



            

Contact Data