Süss MicroTec AG / AGM/EGM 25.06.2009 Release of a Corporate News, transmitted by DGAP - a company of EquityStory AG. The issuer is solely responsible for the content of this announcement. --------------------------------------------------------------------------- Press Release SUSS MicroTec AG: Shareholder's Meeting in Munich Munich, Germany, June 25, 2009 - At the ordinary shareholder's meeting of SUSS MicroTec AG (ISIN: DE0007226706), which took place yesterday in Munich, Germany, 37.7 % of the equity capital was represented. Approximately 120 shareholders, shareholder and bank representatives and guests came to the Haus der Bayerischen Wirtschaft in Munich at the Company's invitation. The Chief Executive Officer, Frank Averdung, explained the results of the previous fiscal year and the first quarter of 2009 in his statement of accounts. The extraordinary charges totaling EUR 18.3 million, which were the main factor burdening net income for the year, were emphasized, as were the restructuring and cost-cutting measures that had been implemented as early as the middle of the year. In addition, the Management Board detailed the Company's orientation in terms of product strategy for the years to come. Averdung stressed in particular, for instance, the future potential and opportunities in the field of 3-D integration, a market of the future in the field of wafer-level packaging. 'With 3M as a strategic cooperation partner in the area of temporary wafer bonding, we are paired with a renowned and innovative development partner,' Averdung told the shareholder's meeting in Munich. 3M's Wafer Support System (WSS) supports the thinning and processing of ultra-thin wafers during the 3-D packaging process by using techniques and materials for temporary wafer bonding. The SUSS MicroTec Bonders are designed to process 3M's WSS materials such as UV-baking liquid adhesive or resist for light-activated separation layers. As a result, SUSS MicroTec has advanced to the position of authorized supplier for the 3M Wafer Support System and will manufacture and sell XBC300 and CBC300 Wafer Bonders configured in-house. 'With our cooperation partners 3M and Thin Materials we now have two top-class process solutions in the area of temporary wafer bonding at our disposal, which will allow us to produce flexible, modular bonder platforms in the future that can be customized to our customers' requirements,' Averdung continued. Agenda items included, in addition to the discharge of the Management Board and Supervisory Board and the appointment of external auditors for the individual and consolidated financial statements, the creation of new contingent capital as well as the election of a new member of the Supervisory Board. Except the creation of new contingent capital and the authorization of the Management Board to issue convertible or warrant-linked bonds the shareholder's meeting voted by a large majority in favor of the resolutions drafted by the Supervisory Board and Management Board of SUSS MicroTec AG. However, counter-motions submitted from the shareholder side were rejected by a majority of votes. The Management Board and Supervisory Board were thus discharged for the 2008 fiscal year by a large majority of the vote. Sebastian Reppegather was elected as successor for Dr. Franz Richter, whose tenure started on June 19, 2008. He will serve for the remainder of the original tenure. Mr. Reppegather is a managing director of IED Beteiligungs-GmbH, Frankfurt am Main, Germany, as well as Director of Investment at Fidinam S.A., Lugano, Switzerland. Furthermore Mr. Reppegather is a member of the Supervisory Board of Sterling Strategic Value Limited, Tortola, British Virgin Islands. In a constitutive session that took place immediately after the shareholders' meeting, the Supervisory Board elected the Board member Dr. Stefan Reineck as the new Chairman of the Supervisory Board. SUSS MicroTec AG (ISIN DE 0007226706) About SUSS MicroTec SUSS MicroTec is a leading supplier of process and test solutions for markets such as 3-D Integration, Advanced Packaging, MEMS, Nanotechnology and Compound Semiconductor. High-quality solutions enable customers to increase process performance while reducing cost of ownership. SUSS MicroTec supports more than 8,000 installed mask aligners, coaters, bonders and probe systems with a global infrastructure for applications and service. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit http://www.suss.com. Disclaimer This press release contains forward-looking statements relating to the business, financial performance and earnings of SUSS MicroTec AG and its subsidiaries and associates. Forward-looking statements are based on current plans, estimates, projections and expectations and are therefore subject to risks and uncertainties, most of which are difficult to estimate and which in general are beyond the control of SUSS MicroTec AG. Consequently, actual developments as well as actual earnings and performance may differ materially from those which explicitly or implicitly assumed in the forward-looking statements. SUSS MicroTec AG does not intend or accept any obligation to publish updates of these forward-looking statements. Contact: SÜSS MicroTec AG Julia Hartmann Investor Relations / PR Schleissheimer Strasse 90 85748 Garching, Deutschland Tel.: +49 (0)89 32007-161 Fax: +49 (0)89 32007 336 Email: julia.hartmann@suss.com DGAP 25.06.2009 --------------------------------------------------------------------------- Language: English Issuer: Süss MicroTec AG Schleissheimer Strasse 90 85748 Garching b. München Deutschland Phone: +49 (0)89 32007-161 Fax: +49 (0)89 32007-336 E-mail: ir@suss.com Internet: www.suss.com ISIN: DE0007226706 WKN: 722670 Listed: Regulierter Markt in Frankfurt (Prime Standard); Freiverkehr in Berlin, Düsseldorf, Hamburg, München, Stuttgart End of News DGAP News-Service ---------------------------------------------------------------------------
DGAP-News: Süss MicroTec AG: Shareholder's Meeting in Munich
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