Süss MicroTec AG / Alliance
28.01.2010
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Cascade Microtech, Inc. and SUSS MicroTec AG Forge Technology Alliance
Strategic partnership will allow industry leaders to collaborate on 3D
Integration requirements for semiconductor market
Beaverton, OR and Garching/Munich, Germany - January 28, 2010 - Cascade
Microtech, Inc. (NASDAQ: CSCD), a worldwide leader in the precise
electrical and mechanical measurement and test of integrated circuits (ICs)
and other small structures and SUSS MicroTec AG (ISIN: DE0007226706), a
leading supplier of equipment and process solutions for the semiconductor
industry and related markets announced today that they have entered into a
strategic partnership to address the growing device complexities of
emerging semiconductor technologies such as 3D TSV manufacturing and test.
Over the last few decades Moore's Law (the doubling of device performance
every two years) has enabled the semiconductor companies to increase speed,
functionality and complexity while reducing cost at the same time. As
companies are driving beyond 32 nm, the cost position becomes less
favorable and interconnect technology is limiting performance gains.
Emerging 3D methodologies (the stacking of one die or wafer on top of
another) are addressing these dilemmas. Adoption of 3D TSV (Through-Silicon
Via) is the ultimate in 3D integration providing higher performance,
reduced noise, smaller device form factor, and modularity in construction
at potentially lower cost.
By forming a strategic alliance, the two companies will bring innovative
approaches to the 3D TSV manufacturing processes. Both companies will use
their associations with leading research organizations such as IMEC, as
well as industry partnerships, to gain insight into this cutting-edge
methodology driving beyond Moore's Law. Further collaboration with device
and reliability experts will allow the alliance to address the complexities
and interactions of semiconductor bonding and test probing for
next-generation semiconductor devices.
'SUSS MicroTec shares Cascade Microtech's commitment to develop the most
advanced technologies for the continued improvement of semiconductor
technologies,' said Frank P. Averdung, President and CEO of SUSS MicroTec
AG. 'The comprehensive knowledge of the two companies will enable both
companies to better address the issues inherent in 3D Integration.'
'This joint research initiative with SUSS MicroTec reinforces Cascade
Microtech's commitment to develop practical solutions for leading-edge
technologies that increasingly rely on new structures for continued
performance improvement,' said F. Paul Carlson, Chairman and CEO of Cascade
Microtech, Inc. 'We look forward to collaborating with SUSS MicroTec on
innovative ways to characterize and evaluate new design methodologies and
manufacturing processes, which will benefit our common customers, as well
as the industries we serve.'
SUSS MicroTec AG (ISIN DE 0007226706)
About SUSS MicroTec AG
SUSS MicroTec is a leading supplier of equipment and process solutions for
markets such as 3-D Integration, Advanced Packaging, MEMS, Nanotechnology
and Compound Semiconductor. High-quality solutions enable customers to
increase process performance while reducing cost of ownership. SUSS
MicroTec supports more than 8,000 installed mask aligners, coaters, bonders
and probe systems with a global infrastructure for applications and
service. SUSS MicroTec is headquartered in Garching near Munich, Germany.
For more information, please visit http://www.suss.com
About Cascade Microtech, Inc.
Cascade Microtech, Inc. (NASDAQ: CSCD) is a worldwide leader in the precise
electrical and mechanical measurement and test of integrated circuits (ICs)
and other small structures. For technology businesses and scientific
institutions that need to evaluate small structures, Cascade Microtech
delivers access to electrical data from wafers, integrated circuits (ICs),
IC packages, circuit boards and modules, MEMS, biological structures, 3D
TSV, LED devices and more. Cascade Microtech's leading-edge semiconductor
production test products include unique probe cards and test sockets that
reduce manufacturing costs of high-speed and high-density semiconductor
chips.
For more information visit www.cascademicrotech.com.
Disclaimer
This press release contains forward-looking statements relating to the
business, financial performance and earnings of SUSS MicroTec AG and its
subsidiaries and associates. Forward-looking statements are based on
current plans, estimates, projections and expectations and are therefore
subject to risks and uncertainties, most of which are difficult to estimate
and which in general are beyond the control of SUSS MicroTec AG.
Consequently, actual developments as well as actual earnings and
performance may differ materially from those which explicitly or implicitly
assumed in the forward-looking statements. SUSS MicroTec AG does not intend
or accept any obligation to publish updates of these forward-looking
statements.
SÃSS MicroTec AG
Julia Hartmann
Investor Relations / PR
Schleissheimer Strasse 90
85748 Garching, Deutschland
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007 336
Email: julia.hartmann@suss.com
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Language: English
Company: Süss MicroTec AG
Schleissheimer Strasse 90
85748 Garching b. München
Deutschland
Phone: +49 (0)89 32007-161
Fax: +49 (0)89 32007-336
E-mail: ir@suss.com
Internet: www.suss.com
ISIN: DE0007226706
WKN: 722670
Listed: Regulierter Markt in Frankfurt (Prime Standard); Freiverkehr
in Berlin, Düsseldorf, München, Hamburg, Stuttgart
End of News DGAP News-Service
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DGAP-News: Süss MicroTec AG: Cascade Microtech, Inc. and SUSS MicroTec AG Forge Technology Alliance
| Source: EQS Group AG