DGAP-Adhoc: Süss MicroTec AG Publishes Final Figures for 2009 Fiscal Year


Süss MicroTec AG / Final Results

30.03.2010 07:14 

Dissemination of an Ad hoc announcement according to § 15 WpHG, transmitted by
DGAP - a company of EquityStory AG.
The issuer is solely responsible for the content of this announcement.

---------------------------------------------------------------------------


SUSS MicroTec AG Publishes Final Figures for 2009 Fiscal Year

Business Remains Profitable Despite Difficult Market Environment and
Downturn in Sales

Garching near Munich, Germany, March 30, 2010 - SUSS MicroTec AG (business
address: Schleissheimer Strasse 90, 85748 Garching, Germany; ISIN:
DE0007226706), which is listed in the Prime Standard of Deutsche Börse AG,
published its consolidated financial statements for the 2009 fiscal year
today. The figures show that the Company experienced a decline in both
sales and order entry in the past fiscal year, reflecting economic and
industry-specific conditions. Excluding the discontinued Test Systems
division, the SUSS MicroTec Group generated sales of EUR 103.9 million,
falling short of the previous year's level of EUR 121.5 million by
approximately 15%. Order entry in the continuing operations fell compared
with the previous year by 19% to EUR 96.3 million (previous year: EUR 118.2
million). As of December 31, 2009, the order backlog from continuing
operations amounted to EUR 57.0 million (12/31/2008: EUR 65.1 million).

While the Group's core division - Lithography - posted a 22% decline in
sales to EUR 77.6 million (previous year: EUR 98.8 million) during the year
under review, the Substrate Bonder division succeeded in growing its
revenues by approximately 14% to EUR 18.3 million (previous year: EUR 16.2
million). The downswing in Lithography was largely due to reluctance to
invest among production clients in the semiconductor industry, especially
at the beginning of 2009. By contrast, the Substrate Bonder division
benefited from its extended product range and the increasing importance of
bonding equipment in the manufacturing process of future three-dimensional
chip structures (3D integration).

Despite the difficult overall market environment and the resulting sharp
drop in sales, the Company succeeded in achieving positive earnings before
interest and taxes (EBIT) of EUR 2.8 million from continuing activities in
the past fiscal year. In the previous year, extraordinary expenses of EUR
17.2 million had a major impact on EBIT, which came in at EUR -8.7 million.
The positive development was brought about by implementing both operational
and structural cost savings measures at an early stage. These permanently
lowered the breakeven point.

Earnings after taxes (EAT) from continuing operations amounted to EUR 0.5
million, compared to EUR -11.6 million in the previous year. The basic
earnings per share (EPS), therefore, totaled EUR 0.03 (previous year: EUR
-0.68).

Liquidity

Compared to the previous year, cash and securities rose from EUR 24.4
million to EUR 31.1 million. Net liquidity increased significantly by the
end of the fiscal year, coming in at EUR 18.4 million (12/31/2008: EUR 9.4
million). In addition, the Company clearly achieved its goal of generating
positive free cash flow. Excluding securities acquisitions of EUR 6.7
million (previous year: EUR 3.8 million), the free cash flow came to EUR
8.9 million at the end of the fiscal year (previous year: EUR 1.9 million).
The reduction in inventories and accounts receivable had a positive impact
on this figure.

Outlook

After an unusually strong fourth quarter in 2009, the Company anticipates
order entry totaling approximately EUR 30 million for the first three
months of 2010 along with sales less than EUR 20 million. All in all, the
Management Board expects sales totaling slightly below EUR 120 million for
the current fiscal year, 2010, when HamaTech APE will be included in the
accounts for the first time. The Company also expects EBIT to improve
slightly compared with the previous year. Free cash flow should remain
positive before completed M&A transactions are taken into account.

End of the ad hoc announcement


30.03.2010 07:14 Ad hoc announcement, Financial News and Media Release distributed by DGAP. Medienarchiv at |[![CDATA[|[a href="http://www.dgap-medientreff.de"|]www.dgap-medientreff.de|[/a|]]]|] and |[![CDATA[|[a href="http://www.dgap.de"|]www.dgap.de|[/a|]]]|]

---------------------------------------------------------------------------
 
Language:     English
Company:      Süss MicroTec AG
              Schleissheimer Strasse 90
              85748 Garching b. München
              Deutschland
Phone:        +49 (0)89 32007-161
Fax:          +49 (0)89 32007-336
E-mail:       ir@suss.com
Internet:     www.suss.com
ISIN:         DE0007226706
WKN:          722670
Listed:       Regulierter Markt in Frankfurt (Prime Standard); Freiverkehr
              in Berlin, Düsseldorf, München, Hamburg, Stuttgart
 
End of News                                     DGAP News-Service
 
---------------------------------------------------------------------------