IRVINE, Calif., Aug. 17, 2010 (GLOBE NEWSWIRE) -- Microsemi Corporation (Nasdaq:MSCC), a leading manufacturer of high performance analog/mixed signal integrated circuits, high reliability semiconductors and RF subsystems, today announced the LX5514M power amplifier (PA) in a compact package that matches the industry's smallest 1.5x1.5mm, 0.4mm-high footprint.
Microsemi's LX5514M power amplifier supports IEEE 802.11b/g/n WLAN applications in the 2.4-2.5GHz frequency range. It joins the company's recently introduced LX5553 and LX5543 front-end modules (FEM) to continue its expansion into the fast-growing market for WLAN products used in space-constrained smartphones and other data-enabled cellular handset designs. The device is based on the company's proven LX5514 PA, which has been streamlined to fit into a compact, ultra-low-profile package. Like the LX5514, the LX5514M includes fully matched input, simplified output matching, an integrated power detect function that not only saves board space but also reduces total BOM cost.
"Board area in today's smartphones is at a premium, and designers must squeeze more functionality into ever-smaller real estate," said Paul Pickle, Vice President and General Manager of Microsemi's Analog Mixed Signal Group. "The LX5514M enables designers to add WLAN capability in nearly half the space of the prior generation of 2mmx2mm PAs, and with a much lower profile that enables today's slim, sleek handset designs. Customers get the industry-leading performance and efficiency of our PAs for routers and other networking equipment, in a package optimized for the stringent space requirements of smartphone designs."
KEY FEATURES
- InGaP HBT process technology for optimal performance and linearity
- 2.4 – 2.5GHz operation
- Single-polarity 3.3V supply
- Quiescent current 80mA
- POUT=19dBm 3% EVM
- Power gain 27dB
- Total current 130mA
Microsemi's broad portfolio of IEEE 802.11a/b/g/n WLAN, 802.16e WiMAX and WiBro power amplifiers are used in a variety of applications including wireless access points and half mini-cards for notebooks and netbooks. Reference designs with market-leading WLAN chipset manufacturers are available for many of Microsemi's power amplifiers.
Pricing and Availability
The LX5514M is in volume production and is offered in a RoHS-compliant, 6-pin, 1.5x1.5mm, 0.4mm-high dual flat no lead (DFN) package. Pricing in 10,000-unit quantities is $0.45. Datasheets, application notes, and evaluation kit information are available at Microsemi's website: http://www.microsemi.com.
Attachment:
Product Photo: http://www.microsemi.com/PRimages/Microsemi_LX5514M_Photo.jpg">http://www.microsemi.com/PRimages/Microsemi_LX5514M_Photo.jpg
About Microsemi
Microsemi Corporation, with corporate headquarters in Irvine, California, is a leading designer, manufacturer and marketer of high performance analog and mixed-signal integrated circuits, high reliability semiconductors and RF subsystems. The company's semiconductors manage and control or regulate power, protect against transient voltage spikes and transmit, receive and amplify signals.
Microsemi's products include individual components as well as integrated circuit solutions that enhance customer designs by improving performance and reliability, battery optimization, reducing size or protecting circuits. The principal markets the company serves include implanted medical, defense/aerospace and satellite, notebook computers, monitors and LCD TVs, automotive and mobile connectivity applications. More information may be obtained by contacting the company directly or by visiting its website at http://www.microsemi.com.
The Microsemi Corporation logo is available at http://www.globenewswire.com/newsroom/prs/?pkgid=1233
"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements concerning the LX5514M power amplifier (PA) in a compact package that matches the industry's smallest 1.5x1.5mm, 0.4mm-high footprint, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.