SHANGHAI, China, Dec. 19, 2011 (GLOBE NEWSWIRE) -- RDA Microelectronics (Nasdaq:RDA) ("RDA Microelectronics" or the "Company"), a fabless semiconductor company that designs, develops and markets Radio Frequency (RF) and mixed-signal chips for cellular, connectivity and broadcast applications, today introduced its RDA5990 combination chipset that integrates Wi-Fi, Bluetooth and FM functionality on a single die. This high performance product provides significant advantages to the global smartphone market by offering higher integration, improved power consumption, minimized board space and lower cost. The Company has begun sampling the product with China handset manufacturers for initial field testing.
The RDA5990 integrates a complete IEEE 802.11 b/g system with Bluetooth 2.1 + EDR and FM radio receiver and transmitter. Combining several proven wireless technologies onto a single silicon die allows the components to work simultaneously and independently, while consuming less power and improving battery life. RDA's superior integration design uses 55nm CMOS process in a compact 6x6 mm 48-pin QFN package, minimizing board space and reducing customer cost. Manufacturers can quickly integrate the RDA5990 on platforms to enable rapid time to market.
Commenting on the product introduction, Vincent Tai, chairman and CEO of RDA Microelectronics, stated, "Integrating Bluetooth, FM and Wi-Fi on a single CMOS die is very challenging and there are only a few companies in the world with proven products in the market. This Wi-Fi combo chip represents a significant milestone in our product development roadmap and demonstrates the strength of our integration capabilities. This chip has one of the smallest die size in the market and is very competitive in terms of performance and cost. The customer interest for this product is extremely high as they have been very eager for us to introduce this chip.
"This product also represents our continued efforts to further penetrate the 3G/4G smartphone market. Most smartphones offer Wi-Fi functionality as a standard feature to enable higher data speeds. Smartphones have shown a 22% CAGR in global volume over the past five years, and it is expected that low-end smartphone volumes will rise rapidly in China as the prices begin to decrease. I believe RDA is well positioned with this product to capitalize on this growing opportunity. RDA generates higher revenue per handset from smartphones than from 2G feature phones, and we expect this product and other products targeted at the 3G/4G market will produce significant revenue over the next several years."
About RDA Microelectronics
RDA Microelectronics is a fabless semiconductor company that designs, develops and markets radio-frequency and mixed-signal semiconductors. The Company's product portfolio currently includes power amplifiers, transceivers and front-end modules, Bluetooth system-on-chip, Wi-Fi, Bluetooth and FM combo chips, FM radio receivers, set-top box tuners, analog mobile television receivers, CMMB mobile television receivers, walkie-talkie transceivers and LNB satellite down converters. For additional information, please see the Company's website at http://www.rdamicro.com.
Forward-Looking Statements
This announcement contains forward-looking statements. These statements are made under the "safe harbor" provisions of the U.S. Private Securities Litigation Reform Act of 1995. These forward-looking statements can be identified by terminology such as "will," "expects," "anticipates," "future," "intends," "plans," "believes," "estimates" and similar statements. Any statements in this press release that are not historical facts are forward-looking statements that involve factors, risks and uncertainties that could cause actual results to differ materially from those in the forward-looking statements. Such factors and risks include the Company's anticipated growth strategies; its future results of operations and financial condition; economic conditions in China; the regulatory environment in China; the Company's ability to attract customers and leverage its brand; trends and competition in the semiconductor industry; and other factors and risks detailed in the Company's filings with the Securities and Exchange Commission. This press release may also contain statements or projections that are based upon information available to the public, as well as other information from sources which the Company believes to be reliable but whose accuracy or completeness the Company cannot guarantee. The Company undertakes no obligation to update or revise any forward-looking statements, whether as a result of new information, future events or otherwise, unless required by applicable law.