Dublin, Oct. 22, 2013 (GLOBE NEWSWIRE) -- Research and Markets (http://www.researchandmarkets.com/research/ftxtdk/texas_instrument)
has announced the addition of the
"Texas Instrument DLP® PicoTM projector family - Reverse Costing
Report" report to their offering.
System Plus Consulting is proud to publish the reverse costing
report of three DLP® Pico projectors (DLP® nHD, DLP® 0.17 HVGA and
the DLP® 0.3 WVGA) supplied by Texas instrument.
Featuring a nHD resolution (640 x 360) and packaged in a small
ceramic housing (16mm x 6.9mm), The DLP nHD, is the thinnest and
the smallest DLP Pico projector. It is ideally suited for mobile
application and was extracted from the Galaxy beam phone.
The DLP1700, features a Half-VGA Resolution (480 x 320), and has a
0.17-Inch Micromirror Array Diagonal, while the DLP3000 features a
Wide-VGA Resolution (608 × 684) and has a 0.3-Inch Micromirror
Array Diagonal.
Both of them, are ideally suited for Pocket Projectors and were
extracted from Optima devices.
Key Topics Covered:
Overview / Introduction
Texas instrument Company Profile
Physical Analysis
- Synthesis of the Physical Analysis
- DLP® 0.17 HVGA: Package Characteristic
- DLP® 0.17 HVGA: Package Opening
- DLP® 0.17 HVGA: Package Cross Section
- DLP® 0.17 HVGA: Process technology
- DLP® 0.17 HVGA: Micromirrors-Pictures
- DLP® 0.3 WVGA: Package Characteristics
- DLP® 0.3 WVGA: Package Opening
- DLP® 0.3 WVGA: Package Cross Section
- DLP® 0.3 WVGA: Process technology
- DLP® 0.3 WVGA: Micromirrors-Pictures
- DLP® nHD: Package Characteristics
- DLP® nHD: Package Opening
- DLP® nHD: Package Cross Section
- DLP® nHD: Process technology
- DLP® nHD: Micromirrors-Pictures
Manufacturing Process Flow
- Wafers Fabrication Units
- Front-End Manufacturing Process Flow:
- Back-End Packaging Process Flow
- Back-End Packaging Assembly Unit
Cost Analysis
- Synthesis of the Cost Analysis
- CMOS Wafer Front-End Cost
- CMOS Die Cost
- MEMS Wafer Front-End Cost
- MEMS Front-End Cost per Steps
- MEMS Front-End Cost per Equipment
- MEMS Front-End Cost per Consumables
- MEMS Die Cost
- Back-End : Package Cost
- Back-End : Package Cost Per Steps
- Manufacturing Cost
Estimated Manufacturer Price
For more information visit
http://www.researchandmarkets.com/research/ftxtdk/texas_instrument
Research and Markets
Laura Wood, Senior Manager.
press@researchandmarkets.com
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector:
Telecommunications and Networks