FEI Releases New Helios NanoLab G3 DualBeam

Next Generation DualBeam Extends Helios Performance Leadership While Enhancing Usability With a New User Interface and Workflow-Specific Configurations

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| Source: FEI Company

HILLSBORO, Ore., Sept. 3, 2014 (GLOBE NEWSWIRE) -- FEI (Nasdaq:FEIC) announced today the release of the next generation of its industry-leading Helios NanoLab™ DualBeam™. The Helios NanoLab G3 DualBeam extends the Helios family's leadership position with unmatched image contrast and resolution, while at the same time, adding a new, easy-to-use user interface. The new Helios comes in two different workflow-specific configurations for materials science research. It will be featured in the FEI booth at the International Microscopy Congress, September 7-12, in Prague, Czech Republic.

"The Helios NanoLab G3 DualBeam continues FEI's well-established leadership in DualBeam instrumentation, building on a long history of performance and innovation from the first commercial DualBeam, which FEI launched more than 20 years ago, to the Helios PFIB™ DualBeam just announced at the Microscopy and Microanalysis show last month," said Trisha Rice, vice president and general manager of Materials Science for FEI. "This third generation of the Helios family continues to provide the high resolution and strong image contrast that the family is known for, but adds a new interface that can actually guide the user through typical operations. We have optimized each of the configurations for a particular class of workflows, based on customer feedback and our long and deep involvement in DualBeam analysis."

The DualBeam instruments' ability to see structure and composition and add and remove material at the nanometer scale allows materials scientists to explore fundamental relationships between structure and function and prepare ultrathin samples for atomic scale analysis in transmission electron microscopes (TEM).

The CX configuration of the Helios NanoLab G3 DualBeam includes more versatile sample handling and positioning for fast, flexible analysis, sample preparation and characterization. The UC configuration delivers the ultimate imaging capability with increased sensitivity to surface detail and improved performance on soft, non-conductive or beam-sensitive materials.

Please visit www.fei.com/helios-g3 for more information, or stop by the FEI booth (#6) at the International Microscopy Congress.

About FEI

FEI Company (Nasdaq:FEIC) designs, manufactures and supports a broad range of high-performance microscopy workflow solutions that provide images and answers at the micro-, nano- and picometer scales. Its innovation and leadership enable customers in industry and science to increase productivity and make breakthrough discoveries. Headquartered in Hillsboro, Ore., USA, FEI has over 2,600 employees and sales and service operations in more than 50 countries around the world. More information can be found at: www.fei.com.

FEI Safe Harbor Statement

This news release contains forward-looking statements that include statements regarding the performance capabilities and benefits of the Helios NanoLab G3 DualBeam. Factors that could affect these forward-looking statements include but are not limited to our ability to manufacture, ship, deliver and install the tools or software as expected; failure of the product or technology to perform as expected; unexpected technology problems and challenges; changes to the technology; the inability of FEI, its suppliers or project partners to make the technological advances required for the technology to achieve anticipated results; and the inability of the customer to deploy the tools or develop and deploy the expected new applications. Please also refer to our Form 10-K, Forms 10-Q, Forms 8-K and other filings with the U.S. Securities and Exchange Commission for additional information on these factors and other factors that could cause actual results to differ materially from the forward-looking statements. FEI assumes no duty to update forward-looking statements.
 

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