FREMONT, Calif., Dec. 2, 2014 (GLOBE NEWSWIRE) -- Aehr Test Systems (Nasdaq:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced that Gayn Erickson, President and CEO, will participate in the Third Annual Midtown CAP Investor Summit 2014 being held December 10, 2014 at the Marriott Marquis Hotel in New York City.
Aehr Test will post its presentation materials used at the conference on the Investor Relations section of the Company's website at www.aehr.com.
About the Midtown CAP Summit
The Midtown CAP Summit is by invitation only and is open to accredited investors and publishing research analysts. The event is hosted by executive management from the following participating companies: Aehr Test Systems (AEHR), Axcelis (ACLS), Brooks Automation (BRKS), Cascade Micro (CSCD), Cohu (COHU), Electro Scientific (ESIO), FormFactor (FORM), inTEST (INTT), Intevac (IVAC), Mattson Technology (MTSN), Nanometrics (NANO), Rudolph Technologies (RTEC), Ultra Clean Technology (UCTT), Ultratech (UTEK) and Xcerra Corporation (XCRA), and will feature a "round-robin" format consisting of a series of small group meetings.
About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic and memory integrated circuits and has an installed base of more than 2,500 systems worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, capacity needs and opportunities for Aehr Test products in package and wafer level test. Aehr Test has developed and introduced several innovative products, including the ABTSTM and FOXTM families of test and burn-in systems and the DiePak® carrier. The ABTS system is used in production and qualification testing of packaged parts for both low-power and high-power logic as well as all common types of memory devices. The FOX system is a full wafer contact test and burn-in system used for burn-in and functional test of complex devices, such as leading-edge memories, digital signal processors, microprocessors, microcontrollers and systems-on-a- chip. The DiePak carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of bare die. For more information, please visit the Company's website at www.aehr.com.