Global On-Chip and Chip-to-Chip Optical Interconnects Markets 2015 to 2024

Dublin, Feb. 16, 2015 (GLOBE NEWSWIRE) -- Research and Markets (http://www.researchandmarkets.com/research/sz9qvv/markets_for) has announced the addition of the "Markets for On-Chip and Chip-to-Chip Optical Interconnects - 2015 to 2024" report to their offering.

The so-called interconnect bottleneck is creating opportunities for optical device and cable makers or all kinds. Process scaling, power consumption and operating frequency have all need to move away from metal interconnects and into the optical realm. This need is increasing with each new node; in high performance processors with metal tracks, clock distribution alone can use up to 50% of total chip power.

In this report, the author analyzes both the latest commercial developments in optical interconnection at the chip level (both on-chip and chip-to-chip) and the progress in this area that is being made by important research teams worldwide. The coverage includes an investigation into the very latest architectures, devices, and materials that are impacting the prospects for on-chip and chip-to-chip optical connection. Among the topics covered by the report are the following:

- The rise of optical engines and how these fit into future chip-to-chip connectivity. How will the architectures of these devices and materials used change as device dimensions shrink and what is the revenue potential of optical engines over the next ten years

- An assessment of how novel photonic devices will be used in on-chip/chip-to-chip connections, analyzing the market potential of compound semiconductors versus the silicon photonics approach.

- The market for approaches to optical interconnection that uses novel materials. Polymers, a material that has a long history, may finally find a role. Possible roadmaps for optical interconnection that use carbon nanotubes are also considered.

- The commercialization of CMOS compatible optical interconnection using 3D architectures and other solutions

This report also contains a 10-year analysis that quantifies where and when the commercial opportunities for optical interconnection at the chip level will emerge and how much they will be worth. We also profile the leading firms and research efforts involved in designing and implementing on-chip and chip-to-chip optical interconnection.

The author has been tracking the market for optical interconnects for almost a decade and is the leading industry analyst firm providing coverage in this this area. The report will be of considerable interest to marketing managers, business development executives and product managers in the semiconductor and data communications industries. It will also be of use to serious investors in these and other related industries.

Key Topics Covered:

Executive Summary
E.1 Important Developments in On-Chip/Chip-to-Chip Interconnection in 2014
E.2 Why the "Interconnect Bottleneck" Creates Opportunities for the Photonics Industry
E.3 Current and Future Challenges for Chip-Level Optical Interconnection
E.4 Summary of 10-year Market Forecasts for Chip-Level Interconnection
E.5 Eight Companies to Watch in the On-Chip/Chip-to-Chip Business

Chapter One: Introduction
1.1 Background to this Report
1.1.1 Markets for Chip-Related Optical Interconnection: Players, Products and Opportunities
1.1.2 Optical Engines and Backplanes: Immediate Revenues from Optical Interconnect?
1.1.3 Emerging Technologies for Chip-Based Optical Interconnection: Long-Term Opportunities
1.2 Objectives of this Report
1.3 Methodology and Information Sources for this Report

Chapter Two: Analysis of Demand for On-Chip/Chip-to-Chip Interconnection
2.1 Moore's Law, Scaling and Interconnect
2.2 Content Drivers for Optical Interconnect at the Chip Level
2 3 Limits to Electronic Interconnects and Strategies for Dealing with them
2.4 Market Threats to Optical Interconnect
2.5 A Possible Transition to Optical Computing and Communications: Interconnect Implications
2.6 Key Points Made in this Chapter

Chapter Three: Technologies for On-Chip/Chip-to-Chip Interconnect
3.1 Chip-Level Optical Interconnect Technology
3.2 Multicore Processing and Interconnect
3.3 VCSELs for Interconnect: Getting Faster
3.4 Implications of Novel Laser R&D for Optical Interconnection
3.5 Other Components Suitable for the Optical Interconnect Market
3.6 Optical Engines
3.7 Nanocarbon as an Alternative to Optical Interconnect
3.8 Key Points Made in this Chapter

Chapter Four: Chip Level Optical Interconnection, Technology Platforms and Ten-Year Market Forecasts
4.1 Forecasting Methodology and Forecasting Assumptions
4.2 The Role of Optical Integration Platforms in Future Chip-Based Interconnection
4.3 Silicon Photonics
4.4 Opportunities for Fiber, Waveguides and Free-Space Optics in Chip-Level Interconnect
4.5 Key Points Made in this Chapter

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