AppliedMicro Introduces X-Tend(TM): Breakthrough Scale-Out Interconnect Technology

X-Tend Leverages Open Standards-Based Technologies to Provide Ultra High Density Scale Out and Virtual Scale-Up Servers


SANTA CLARA, Calif., Nov. 16, 2015 (GLOBE NEWSWIRE) -- Applied Micro Circuits Corporation (Nasdaq:AMCC), a global leader in computing and connectivity solutions, today announced the availability of X-Tend™ interconnect technology, enabling multiple generations of X-Gene® SoCs to be connected seamlessly with large, elastic memory pools.

Emerging data center workloads, including data mining, real-time analytics, predictive analysis and machine learning, demand minimal latency with just-in-time, elastic provisioning of compute and memory resources. Comprised of on-chip and software components, X-Tend connects multiple X-Gene nodes to each other while presenting multiple terabytes of shared DRAM memory as a single cluster.

"The work that went into AppliedMicro's X-Tend interconnect is a real engineering accomplishment," said Jimmy Pike, technologist in residence at Moor Insights and Strategy. "The promise of X-Tend to provide a single interconnect system that serves as the physical layer for large scale-out solutions and at the same time provide the means for virtual scale-up solutions represents a substantial step forward for AppliedMicro and the ARM server ecosystem."

"X-Tend utilizes open standards, including PCI Express, to provide multi-socket configurations with a single symmetric multiprocessor OS image, accessing huge memory pools with very low latency," said Paramesh Gopi, president and CEO, AppliedMicro. "On-demand scale-up capability is particularly applicable to compute-intensive workloads like high-performance computing and advanced search algorithms." 

X-Tend evaluation platforms are already shipping to AppliedMicro's customers. Additionally, the company will feature a live demonstration of X-Tend in booth No. 3103 at SC15 in Austin, Texas, Nov. 16 - Nov. 19, 2015.

About AppliedMicro

Applied Micro Circuits Corporation (NASDAQ:AMCC) is a global leader in computing and connectivity solutions for next-generation cloud infrastructure and data centers. AppliedMicro delivers silicon solutions that dramatically lower total cost of ownership. Corporate headquarters are located in Santa Clara, California. www.apm.com.

(C) Copyright 2015. Applied Micro Circuits Corporation, AppliedMicro, X-Gene, X-Weave, Server on a Chip, and Cloud Server are trademarks or registered trademarks of Applied Micro Circuits Corporation. All other product or service names are the property of their respective owners.



            

Contact Data