Complete Tear-Down Analysis of Melexis MLX90809 Relative Pressure Sensor

Dublin, April 11, 2016 (GLOBE NEWSWIRE) -- Research and Markets has announced the addition of the "Melexis MLX90809 Relative Pressure Sensor - Complete Tear-Down Analysis" report to their offering.

The MLX90809 is an integrated relative pressure sensor for industrial and automotive applications in harsh environments. It operates over temperatures ranging from -40°C to 150°C and pressures between 0 and 1 bar, with an accuracy of 1.5%. The circuit is available with analog or digital SENT protocol output.

It is easy to use, factory calibrated, fully programmable and integrates analog functions like voltage regulators. The internal diagnostic functions ensure that measurement accuracy is maintained over the time.

Melexis uses smart packaging that is cheap and easy to integrate into a system. The relative pressure measurement uses a soft coating rather than complex packaging with manifolds. The coating protects the silicon die while allowing movement of the membrane.

The MLX90809 is the second generation integrated relative pressure sensor from Melexis. The company has more than 10 years' experience in pressure sensors and more than 20 years' experience in MEMS interface ICs.

This report presents a detailed analysis of the sensor structure and its cost.

Key Topics Covered:

1. Glossary

2. Overview / Introduction
- Executive summary
- MLX90809

3. Company profile
- Melexis
- X-Fab

4. Physical analysis
- Physical analysis methodology
- Package
-- Package
-- Package opening
-- Wire bonding
-- Package cross-section
- Pressure sensor die
-- Sensor die view and dimensions
-- Pressure sensor views
-- Pressure sensor delayering and main blocks
-- Membrane
-- Piezo-resistors
-- Pressure sensor cross-section
-- Sensor die process characteristic

5. Sensor Manufacturing Process
- Sensor Die Front-End Process and Fabrication Unit
- Pressure Sensor Die Process
- Packaging Process and Fabrication unit

6. Cost Analysis
- Synthesis of the Cost Analysis
- Main Steps of Economic Analysis
- Yield Explanation and Hypotheses
- Sensor Die
-- CMOS Wafer Front-End Cost
-- Back Side Process Wafer Cost
-- Back Side Process Step Cost
-- Probe Test and Dicing
-- Sensor Die Wafer Cost
-- Sensor Die Cost
- Packaged Component
-- Packaging Cost
-- Back End: Final Test
-- Component Cost

Companies Mentioned

- Melexis
- X-Fab

For more information visit http://www.researchandmarkets.com/research/7f5w2r/melexis_mlx90809