Photonic Integrated Circuit (PIC) Market 2013-2020 - Global Strategic Analysis Report 2016 - Optical Signal Processing, Optical Communications, and Others


Dublin, April 28, 2016 (GLOBE NEWSWIRE) -- Research and Markets has announced the addition of the "Photonic Integrated Circuit (PIC) - Global Strategic Analysis" report to their offering.

This report analyzes the worldwide markets for Photonic Integrated Circuit (PIC) in US$ Thousand. The Global market is further analyzed by the following Applications and Integration Methods: By Application - Optical Signal Processing, Optical Communications, and Others; By Integration Methods - Packaging, and Others.

The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World. Annual estimates and forecasts are provided for the period 2013 through 2020.

Market data and analytics are derived from primary and secondary research. Company profiles are primarily based on public domain information including company URLs.

The report profiles 52 companies including many key and niche players such as:

  • Alcatel-Lucent
  • Avago Technologies
  • Ciena Corporation
  • Enablence Technologies, Inc.
  • Huawei Technologies Co., Ltd.

Key Topics Covered:

1. INDUSTRY OVERVIEW
A Prelude
PIC Assumes Critical Importance Amid Expanding Role of Optical Communication in the Telecom Sector
Key Trends Influencing the Uptake of PICs in Optical Communication Space
Soaring Deployments of 100G & Ultra-100G OTNs
Growing Uptake of FTTx Networks
Increased Emphasis on Optical Signal Processing in Fiber Optic Networks Extends Novel Opportunities for PIC
Market Outlook

2. MARKET TRENDS & GROWTH DRIVERS
Growing Bandwidth Needs Necessitates Strengthening of Fiber Optic Networks
Strong Business Case for PIC
Key Factors Influencing IP Traffic Growth & Bandwidth Needs
Sharp Increase in Number of Internet Subscribers
High Penetration of IP-enabled Devices
Faster Broadband Speeds
Proliferation of Bandwidth-Intensive Applications
Surging Investments on Advanced Telecom Infrastructure Set to Fuel Wider Adoption of PICs
Infrastructure Verticals Where Telecom Investments Continue to Remain High
Long-Haul Networks
Metropolitan Area Networks (MANs)
Access Networks
Expanding Role of DCI in Data Centers Creates Potential Market Opportunities
Data Center Interconnect (DCI) Related Needs of Enterprises by Sector: A Snapshot
Major Data Center Trends Influencing DCI Implementations
Rapid Growth in Data Center Traffic
Sharp Increase in Cloud Data Center Traffic
Transition towards Data Center Consolidation
Growing Role of Virtualization
High Tide in Wi-Fi Equipment Installations Bodes Well for Market Growth
Biophotonics: A Niche Market Segment for PIC
Expanding Application Base for Biophotonics Generates Parallel Opportunities for PIC
Increased Focus on Optical In-Vitro Diagnostics Augurs Well
Northbound Trajectory in Fiber Optic Sensors Vertical Gives Impetus to Market Growth
Smart Cities Concept to Underpin Sales Growth in the Coming Years
Smart Homes to Drive Demand for PICs
Upcoming Quantum Computing Model to Infuse New Growth Opportunities
Indium Phosphide Emerges as Material of Choice in PIC Manufacturing
Use of Silicon Substrates Gathers Steam
Packaging Integration or Hybrid Integration: The Widely Used PIC Fabrication Method
Monolithic Integration Making Steady Progress in PIC Fabrication
Economic Unviability of Electronic IC in OEO Conversion Puts Focus on Photonic IC
Reduced Number of Optical Packages: Another Major Advantage with PIC
Decreased Need for Fiber Coupling Further Enhances the Image of PIC

3. PRODUCT/TECHNOLOGY OVERVIEW
Introduction
Photonic IC vs. Electronic IC
Photonic IC vs. Electronic IC: A Comparative Analysis
Materials Used in Manufacture of PIC
Indium Phosphide
Silicon
Silica-on-Silicon (PLC)
Lithium Niobate (LiNbO3)
Gallium Arsenide (GaAs)
Comparative Analysis of Indium Phosphide (InP) and Silicon (Si) in Manufacture of PIC
Integration Models
Packaging Integration or Hybrid Integration
Monolithic Integration
Module Integration
Comparative Analysis of Packaging, Monolithic, and Module Integration Methods for PIC
Key Benefits of PIC
High Performance
Small Footprint
Low Price
Low Power
Limitations of PIC
Applications
Optical Communications
Optical Signal Processing
Others

4. PRODUCT INTRODUCTIONS/LAUNCHES
Infinera Introduces ePIC-500 and oPIC-100
Acacia Communications Introduces New Single-Chip PIC
Synopsys Introduces RSoft OptSim Circuit
Huawei Launches 200G Photonic Integrated Device
OneChip Photonics Unveils New PIC-based 100Gbps Optical Interconnects

5. RECENT INDUSTRY ACTIVITY
Nokia Acquires Majority Stake in Alcatel-Lucent
Avago Technologies to Acquire Broadcom
Avago Receives European Union's Approval for Broadcom's Acquisition
NeoPhotonics Launches New Production Unit in Russia
Intel to Acquire Axxia Networking Business of LSI from Avago Technologies
Huawei and Imec Focus on Silicon Photonics Project
Infinera Delivers DTN-X Platform to TeliaSonera
NeoPhotonics to Acquire LAPIS Semiconductor's OCU Business
O-Net Group Inks Agreement with ArtIC Photonics

6. FOCUS ON SELECT GLOBAL PLAYERS
Alcatel-Lucent (France)
Avago Technologies (Singapore)
Ciena Corporation (US)
Enablence Technologies, Inc. (Canada)
Huawei Technologies Co., Ltd. (China)
Infinera Corporation (US)
Kaiam Corporation (US)
Lumentum Holdings, Inc. (US)
NeoPhotonics Corporation (US)
Oclaro, Inc. (US)

7. GLOBAL MARKET PERSPECTIVE

Total Companies Profiled: 52

  • The United States (28)
  • Canada (4)
  • Japan (2)
  • Europe (14)
  • - France (3)
  • - Germany (2)
  • - Spain (1)
  • - Rest of Europe (8)
  • Asia-Pacific (Excluding Japan) (2)
  • Latin America (1)
  • Middle-East (1)

For more information visit http://www.researchandmarkets.com/research/t2wl7r/photonic




            

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