Global Probe Card Market 2016-2020 with FormFactor, Japan Electronic Materials, Micronics Japan, MPI & Technoprobe Dominating


Dublin, Aug. 24, 2016 (GLOBE NEWSWIRE) -- Research and Markets has announced the addition of the "Global Probe Card Market 2016-2020" report to their offering.

The global probe card market to grow at a CAGR of 4.38% during the period 2016-2020.

The cost of the equipment also varies accordingly. Probe cards are test equipment devices that are used by semiconductor device manufacturers to perform wafer test or wafer sort. Probe cards are used to test the semiconductor die or chips while the die is still constituted on the semiconductor wafer.

The report covers the present scenario and the growth prospects of the global probe card market for 2016-2020. To calculate the market size, the report covers the revenue generated from the global shipments of probe cards across SoC and memory application segments.

Emergence of new testing technologies will be a key trend for market growth. The test equipment industry is seeing the emergence of new technologies to meet the growing demand for compact and efficient semiconductor test equipment. This is helping the test equipment vendors to strengthen their offerings. Self-test technologies are being designed into circuits so as to simplify the testing procedures. The introduction of TSV technology is also demanding new testing technologies to ensure the reliability of semiconductors.

According to the report, miniaturization of electronic devices will be a key driver for market growth. The demand for compact electronics has been aggregating in almost every sector, be it communication device, automotive, industrial manufacturing, or healthcare equipment. This trend has forced the semiconductor IC manufacturers to spend on R&D in order to reduce the size and increase the performance of ICs, which has led to the emergence of microelectromechanical systems (MEMS) and 3D stacked ICs based on TSVs in which the interconnections, or vias, penetrate the silicon wafer to achieve higher vias density.

Key vendors

- FormFactor
- Japan Electronic Materials (JEM)
- Micronics Japan (MJC)
- MPI
- Technoprobe

Other prominent vendors

- Advantest
- AMST
- BucklingBeam Solutions
- Cascade Microtech
- Feinmetall
- Korea Instrument
- Microfriend
- SV Probe
- TSE
- WILL Technology

Key Topics Covered:

Part 01: Executive summary

Part 02: Scope of the report

Part 03: Market research methodology

Part 04: Introduction

Part 05: Industry overview

Part 06: Market landscape

Part 07: Market segmentation by end-user segment

Part 08: Market segmentation by product type

Part 09: Market segmentation by geography

Part 10: Summary of key figures

Part 11: Market drivers

Part 12: Impact of drivers

Part 13: Market challenges

Part 14: Impact of drivers and challenges

Part 15: Market trends

Part 16: Vendor landscape

Part 17: Appendix

For more information about this report visit http://www.researchandmarkets.com/research/j8rf9g/global_probe_card

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