Espoo, Finland, 2017-03-24 10:00 CET (GLOBE NEWSWIRE) --
Aspocomp Group Plc, Company Announcement, March 24, 2017 at 11:00 a.m.
Aspocomp Group Oyj - Managers' Transactions
____________________________________________
Person subject to the notification requirement
Name: Joensuun Kauppa ja Kone Oy
Position: Closely associated person
(X) Legal person
(1):Closely associated person
Name: Julianna Borsos
Position: Member of the Board
Issuer: Aspocomp Group Oyj
LEI: 743700W8ZIJAMXWWWD26
Notification type: INITIAL NOTIFICATION
Reference number: 743700W8ZIJAMXWWWD26_20170324100202_2
____________________________________________
Transaction date: 2017-03-23
Venue: NASDAQ HELSINKI LTD (XHEL)
Instrument type: SHARE
ISIN: FI0009008080
Nature of the transaction: ACQUISITION
Transaction Details
(1): Volume: 1000 Unit price: 3,00180 EUR
Aggregated transactions
(1): Volume: 1000 Volume weighted average price: 3.00180 EUR
For further information, please contact Mikko Montonen, CEO,
tel. +358 20 775 6860, mikko.montonen(at)aspocomp.com.
ASPOCOMP GROUP PLC
Mikko Montonen
CEO
Aspocomp – a service company specializing in PCB technologies
Aspocomp specializes in demanding PCB technologies, serving its customers throughout the entire life cycle of a product. Aspocomp sells and manufactures PCBs and also provides related design and logistics services as well as technology solutions. Aspocomp creates value for its customers with unique products and solutions, strong manufacturing and technology expertise, as well as fast and reliable deliveries. A wide network of expert partners together with Aspocomp's own manufacturing enables its customers to cost-effectively buy their PCBs from a single provider over the entire life cycle of a product.
A printed circuit board (PCB) is the principal interconnection method in electronic devices. PCBs are used for electrical interconnection and as a component assembly platform in most electronic applications. Aspocomp's customers are companies that design and manufacture telecom systems and equipment, automotive and industrial electronics, security technology and semiconductor testing systems.