NEW YORK, Oct. 04, 2018 (GLOBE NEWSWIRE) -- Global Dry Film semiconductor packaging market size is expected to grow from USD 117.58 Million in 2017, to USD 165.25 Million in 2024, at a CAGR of 5.0% from 2018 to 2024. Factors propelling the growth of dry film market include demand for more compact, high performance, and low cost electronics, usage of dry films in industrial aqueous-based products and utilization of dry films across various applications. The dry film market is growing with the expansion of the electronics market, including semiconductors and LCDs. The report segments the Dry Film market by Devices (Memory, MEMS, Filter, Micro bump assembly, CMOS, Others), and by region (North America, Europe, Asia-Pacific, Rest of World). The report studies the global Dry Film for semiconductor packaging market over the forecast period (2018-2024).

Dry film is a polyester film coated with a polymer sensitive to ultraviolet light. Photosensitive dry films are mostly used in making the printed wiring boards of PCs, mobile devices, and other electronics. Dry film is of paramount importance in the process of patterning the circuits of electronic devices.

Key Findings From Global Dry Film Semiconductor Packaging Market

  • The global Dry Film semiconductor packaging market is expected to increase from USD 117.58 million in 2017, to USD 165.25 million in 2024, at a CAGR of 5.0% during 2018 -2024
  • The MEMS segment accounted for the largest segment of the global dry film for semiconductor packaging application market in 2017
  • The micro bump assembly segment is expected to emerge as the fastest growing segment, with an estimated CAGR of 6.6% over the next seven years.
  • Asia Pacific region held the largest share of the global dry film for semiconductor packaging application market in 2017, while ascending at a CAGR of 5.5%.
  • Key players in Dry Films Semiconductor Packaging Market are Kolon Industries, DowDuPont, Nikko Material Co. Ltd, Taiyo Holdings Co., Ltd. Shin-Etsu MicroSi, Inc., Asahi kasei, Tokyo Ohka Kogyo Co, Ltd.   are among others.

Dry Film- An advance material for semiconductor Packaging application

Recent development in the packaging technologies that support semiconductor as per the preference of the customer has been on the rise. Consumers today demand high density, thin, downsizing and lightweight packaging solutions. Packaging technologies have transformed over time primarily due to interconnection. Even the wire bonding technology being the most conventional, has enlarged the viable area by meeting the downsizing requirements of smart phones and mobile equipment.

Moreover, these advance-packaging technologies offer greater chip connectivity and lower power consumption relative to conventional packaging configurations. Key market participants in the semiconductor sector, be it memory suppliers, logic producers, foundries or packaging subcontractors, have entered into various strategic alliances as well as partnerships so as to ensure a feasible ecosystem for the advanced packaging develops. Such major developments in the advanced packaging are likely to pave novel opportunities over the years to come.

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Dry Films Semiconductor Packaging  Market- Regional Insight

Asia-Pacific represents largest region for the growth of Dry Films market. The factors driving the Asia-Pacific Dry Films market include large industrialization and economic development. Strong economic development coupled with rising internet traffic and swift propagation of mobile devices is among the major factors driving the surging demand for Dry film in the region. North America was the second largest market in the global dry film market. The North American Dry Film market has experienced an upward trend after experiencing sluggish growth in 2016. The growing number of electronic manufacturer and growing demand for ultra high resolution films is augmenting the growth of the Dry Film market in the region. Further, rising penetration of IoT devices across diverse industries has resulted in the deployment of smart technologies and is likely to fuel global demand for the Dry Film market.

Global Dry Film For Semiconductor Packaging Market, By Device

  • Memory
  • MEMS
  • Filter
  • Micro bump assembly
  • CMOS
  • Others

Global Dry Film For Semiconductor Packaging Market, By Region

  • North America
  • Europe
  • Asia-Pacific (APAC)
  • Rest of the World (RoW)
    • Middle East and Africa (MEA)
    • Central and South America

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