This SEM image shows a high-aspect-ratio through-silicon via (TSV) filled using a Solstice S8 CopperMax single-wafer processing system from ClassOne Technology. VTT Technical Research Centre of Finland has purchased a Solstice S8 for copper TSV plating applications.
This SEM image shows a high-aspect-ratio through-silicon via (TSV) filled using a Solstice S8 CopperMax single-wafer processing system from ClassOne Technology. VTT Technical Research Centre of Finland has purchased a Solstice S8 for copper TSV plating applications.