II-VI’s new DirectProcess 900 FlexShape, with its leading-edge top hat beam parameter profile of 6 mm x mrad, can be dynamically adjusted to an arbitrary rectangular beam width and length ranging from 0.2 to 50 mm for non-contact localized soldering, bonding, and annealing in microelectronic components and connectors.
II-VI’s new DirectProcess 900 FlexShape, with its leading-edge top hat beam parameter profile of 6 mm x mrad, can be dynamically adjusted to an arbitrary rectangular beam width and length ranging from 0.2 to 50 mm for non-contact localized soldering, bonding, and annealing in microelectronic components and connectors.