Applied Materials' Endura® Copper Barrier Seed IMS™ System

Applied Materials_Endura Copper Barrier Seed IMS

Applied Materials’ new Endura® Copper Barrier Seed IMS™ combines seven different process technologies in one system under high vacuum to improve chip performance and power consumption. An animation of the process sequence can be viewed here: https://bit.ly/3g8HMe1.

Format

PNG

Source

Applied Materials, Inc.

Downloads