Axus Technology Sets New Standard for CMP Cost Efficiency on 200mm SiC Wafers

Axus Capstone_CS200-ma

Capstone CS200 CMP systems from Axus Technology enable customers to realize per-wafer CoO savings of more than 50% for CMP processes on 200mm SiC wafers, compared to the closest competitor.

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JPEG

Source

Axus Technology

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