AUO will showcase Glass Core Substrates (GCS) technology for advanced packaging at SEMICON Taiwan 2026, combining Corning’s semiconductor-grade glass with AUO’s Redistribution Layer (RDL) process technology.
AUO will showcase Glass Core Substrates (GCS) technology for advanced packaging at SEMICON Taiwan 2026, combining Corning’s semiconductor-grade glass with AUO’s Redistribution Layer (RDL) process technology.