A single 9-qubit Rigetti chip being loaded into a mount for flip-chip bonding, the process used for assembling Rigetti’s Cepheus-1-36Q processor. Photo credit: Drew Bird Photography
A single 9-qubit Rigetti chip being loaded into a mount for flip-chip bonding, the process used for assembling Rigetti’s Cepheus-1-36Q processor. Photo credit: Drew Bird Photography