Applied Materials’ silicon carbide-optimized Mirra® Durum™ CMP System

Applied Materials_Mirra® Durum™ CMP System

To help enable the silicon carbide chip industry’s move to larger, 200mm wafers, Applied Materials introduced the Mirra® Durum™ CMP system. It produces uniform SiC wafers with the highest quality surfaces by integrating polishing, materials removal measurement, cleaning and drying in a single system.

Format

JPEG

Source

Applied Materials, Inc.

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