5G Radios Shrink With NXP’s New Top-Side Cooling For RF Power
NXP Semiconductors announced a family of top-side cooled RF amplifier modules, based on a packaging innovation designed to enable thinner and lighter radios for 5G infrastructure. These smaller base stations can be more easily and cost-effectively installed, and blend more discretely into their environment.
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JPEG
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NXP USA, Inc.