STATS ChipPAC Completes Expansion of 300mm Wafer Bump and WLCSP Operation in Taiwan
November 16, 2011 23:00 ET
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STATS ChipPAC
SINGAPORE--11/17/2011, UNITED STATES--(Marketwire - Nov 16, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...