STATS ChipPAC Introduces Breakthrough Manufacturing Method for Wafer Level Packaging SINGAPORE--11 MARCH 2014, UNITED STATES--(Marketwired - Mar 11, 2014) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced...

STATS ChipPAC's Fan-Out Wafer Technology Platform Delivers High Performance, Highly Integrated Solutions in a Wide Range of Package Configurations SINGAPORE -- 6/1/2011, UNITED STATES--(Marketwire - May 31, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...