Quik-Pak can work with customers to develop a variety of high-demand substrate packages,e.g., flip-chip QFN, as shown in the bottom-layer (left) and top-layer (right) images above.
Quik-Pak can work with customers to develop a variety of high-demand substrate packages,e.g., flip-chip QFN, as shown in the bottom-layer (left) and top-layer (right) images above.