IRVINE, Calif., April 7, 2010 (GLOBE NEWSWIRE) -- Microsemi Corporation (Nasdaq:MSCC), a leading manufacturer of high performance analog mixed-signal integrated circuits and high reliability semiconductors, today extended its proven family of WLAN power amplifier (PA) solutions with the introduction of the company's first amplifier products for the smartphone market. The highly integrated LX5553™ 802.11b/g/n front-end module (FEM) supports Wi-Fi functionality in space-constrained smartphones and other data-enabled cellular handset designs.
Microsemi's LX5553 FEM combines a 2.4GHz WLAN power amplifier module, low-noise amplifier (LNA) and single-pole triple-throw (PS3T) switch into a compact, 3x3mm package that takes up significantly less space than solutions that use three discrete components for these functions. The FEM is ideal for integrating 802.11b/g/n functionality into today's compact and power-efficient smartphones as well as other 2.4GHz applications. Designed to deliver excellent performance, the device integrates an advanced power amplifier with on-chip impedance matching, a fully matched LNA and a SP3T switch that enables the LX5553 to share a single antenna between WLAN and Bluetooth systems, eliminating the need for an additional antenna.
"The smartphone market is a natural for Microsemi, as one of the leading suppliers of high performance power amplifiers for the WLAN marketplace," said Kang Hee Kim, RF Product Line Manager with Microsemi's Analog Mixed Signal Group. "We have taken the proven performance of our WLAN solutions for access points, home gateways and other products, and packaged it into a solution that handset manufacturers, WLAN baseband partners and ODMs can use to create compact, power-efficient smartphone designs. Customers can implement the LX5553 either in modules or directly into the handset as part of a discrete design."
According to ABI Research's report entitled "Wi-Fi IC Market Share Analysis and Forecasts," released in January, Wi-Fi IC placement in mobile handsets grew by more than 50% in 2009 and Wi-Fi enabled handsets will account for 40% of the total of handsets shipped in 2014. "Despite the uncertain macroeconomic situation, total market demand for Wi-Fi ICs is expected to keep growing," says ABI Research industry analyst Celia Bo. "The demand for Wi-Fi ICs in mobile devices and consumer electronic devices are the two key engines for Wi-Fi IC's market growth."
Key LX5553 Features:
- 2.4-2.5GHz 802.11b/g/n front-end solution
- SP3T for sharing a single antenna between WLAN and Bluetooth systems
- All RF I/O matched to 50 ohms
- Single-supply voltage of 3.0V to 4.2V
- Small footprint: 3x3mm
- Low profile: 0.55mm
- RoHS compliant & Pb-Free
For customers who do not need an LNA, Microsemi also offers the LX5543™, which combines a power amplifier module and SP3T switch in a 3x3mm package at a lower cost.
The LX5553 and LX5543 join Microsemi's broad portfolio of IEEE 802.11a/b/g/n WLAN, 802.16e WiMAX and WiBro power amplifiers, which are used in a variety of applications including wireless access points and half mini-cards for notebooks and netbooks.
Pricing and Availability:
The LX5553 and LX5543 modules are both in volume production. Pricing in OEM quantities of 10,000 is $0.85 for the LX5553 and $0.70 for the LX5543. Each is packaged in a compact 16-pin, 3x3x0.55mm micro-lead package (MLPQ-16L). Data sheets are available on the Microsemi website: http://www.microsemi.com. Application notes and evaluation kit information are available from Microsemi sales representatives: http://www.microsemi.com/contact/contactfind.asp.
Attachments:
Figure l: Microsemi LX5543/53 Image
http://www.microsemi.com/PRImages/LX5543_53_Photo.jpg">http://www.microsemi.com/PRImages/LX5543_53_Photo.jpg
Figure 2: Microsemi LX5553 Block Diagram
http://www.microsemi.com/PRImages/LX5553_Block_Diagram.jpg">http://www.microsemi.com/PRImages/LX5553_Block_Diagram.jpg
Figure 3: Microsemi LX5543 Block Diagram
http://www.microsemi.com/PRImages/LX5543_Block_Diagram.jpg">http://www.microsemi.com/PRImages/LX5543_Block_Diagram.jpg
About Microsemi
Microsemi Corporation, with corporate headquarters in Irvine, California, is a leading designer, manufacturer and marketer of high performance analog and mixed-signal integrated circuits, high reliability semiconductors and RF subsystems. The company's semiconductors manage and control or regulate power, protect against transient voltage spikes and transmit, receive and amplify signals.
Microsemi's products include individual components as well as integrated circuit solutions that enhance customer designs by improving performance and reliability, battery optimization, reducing size or protecting circuits. The principal markets the company serves include implanted medical, defense/aerospace and satellite, notebook computers, monitors and LCD TVs, automotive and mobile connectivity applications. More information may be obtained by contacting the company directly or by visiting its website at www.globenewswire.com/newsroom/ctr%3Fd=181116%26amp;l=4%26amp;u=http%253A%252F%252Fwww.%20">http://www.microsemi.com.
The Microsemi Corporation logo is available at http://www.globenewswire.com/newsroom/prs/?pkgid=1233
"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements concerning the introduction of the company's first amplifier products for the smartphone market, the highly integrated LX5553™ 802.11b/g/n front-end module (FEM), are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.