DGAP-News: High-Speed Digital Materials for Sequential Lamination Technology Gain Momentum

DGAP-News: Isola Group /
High-Speed Digital Materials for Sequential Lamination Technology Gain
Momentum

15.04.2014 / 16:00

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Isola's I-Speed is Recognized for High CAF Reliability and Improved Signal
Integrity in Complex PCB Designs
Isola Group S.a r.l., a market leader in copper-clad laminates and dielectric
prepreg materials used to fabricate advanced multilayer printed circuit boards
(PCBs), announced today that I-Speed(r) has been endorsed by two leading
companies as the laminate of choice for PCBs using sequential lamination
technology, requiring high conductive anodic filament ('CAF') reliability and
improved, cost effective signal integrity. 

Today's PCBs requiring sequential lamination are increasingly complex to
fabricate. This manufacturing process is necessary when the design of the
interconnect system has connections that are not required on all layers or that
if made available on all layers, would affect the system's performance or
create an unsolvable congestion in the design. Boards requiring sequential
lamination must be able to withstand multiple reflow cycles at high assembly
temperatures. 

Steve Robinson, President and CEO of APCT, stated, 'Material choice is a
critical factor in the success with sequential lamination designs. At APCT, we
rely heavily on I-Speed materials from Isola. Other laminates fail after only a
couple of cycles, whereas I-Speed demonstrates excellent performance even after
several lamination cycles. At APCT, any product requiring more than two
lamination cycles automatically defaults to I-Speed.' 

Lee Ritchey, President of Speeding Edge, a training and consulting firm
specializing in high-speed PCB and system designs, stated, 'We had an
independent fabricator build identical signal integrity test vehicles on
competitive materials on boards designed by our company. At Isola's request, we
had the boards tested for insertion loss at our labs. The results proved
I-Speed to be the best in its class for signal integrity.' 

Fred Hickman, Isola's Senior Director of High Speed Digital Products,
commented, 'I-Speed has demonstrated superior sequential lamination performance
versus the competition. A large multinational fabricator, for example,
succeeded on its first 1+8+8+1 HDI build with I-Speed, after failing multiple
times with a competitive product.' Hickman added, 'CAF is another area where
I-Speed delivers best-in-class performance; it has successfully passed 0.65 mm
pitch on an industry-standard test vehicle, as well as the high density product
users group (HDPUG) test vehicle after 6X reflow at 260?C. It also passed the
0.8 mm pitch thermal requirements on both designs without any issues after 6X
reflow at 260?C.' 

I-Speed comes standard with VLP-2 copper with an approximate 2-micrometer (mum)
surface roughness (Rz) without cost premium. I-Speed is in the same UL family
as Isola's IS415, FR408 and FR408HR materials. Processing of I-Speed is very
similar to processing Isola's FR408HR materials. I-Speed offers much lower
Z-axis expansion, improved thermal robustness in lead-free assembly and at
least 15 to 25 percent more bandwidth (lower insertion loss) than competitive
products. 

I-Speed production is scaling up at Isola's manufacturing facility in Chandler,
Ariz. The company plans to transfer production to one of its two facilities in
Taiwan to support the demand for the product in a number of next-generation,
high-speed digital designs, for supercomputers, servers, routers, storage
equipment and lower-end RF applications. 

Tarun Amla, Isola's Executive Vice President and Chief Technology Officer,
commented, 'We are pleased that APCT and Speeding Edge have endorsed I-Speed's
thermal performance, CAF mitigation, sequential lamination and signal
integrity. This material is a cost effective, efficient solution for many of
today's advanced PCBs.' 

For more information about I-Speed, please visit
http://www.isola-group.com/products/i-speed/. 

About Isola

Isola Group S.a r.l., headquartered in Chandler, Arizona, is a global material
sciences company focused on designing, developing, manufacturing, and marketing
copper-clad laminates and dielectric prepregs used to fabricate advanced
multilayer printed circuit boards. The company's high-performance materials are
used in sophisticated electronic applications in the communications
infrastructure, computing/networking, military, medical, aerospace and
automotive industries. For more information, visit our website at
http://www.isola-group.com. 


         Editorial Contact:
         Tiffany C. Zinn
         Global Marketing Communications Manager
         Isola Group
         480-282-6368
         Tiffany.Zinn@isola-group.com
News Source: NASDAQ OMX


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Language:    English        
Company:     Isola Group    
 
 
             United States  
 
 
End of News    DGAP News-Service  
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