Dublin, Nov. 06, 2019 (GLOBE NEWSWIRE) -- The "ESD Packaging - Market Analysis, Trends, and Forecasts" report has been added to ResearchAndMarkets.com's offering.
The ESD Packaging market worldwide is projected to grow by US$1.8 Billion, driven by a compounded growth of 7%.
Communication Network Infrastructure, one of the segments analyzed and sized in this study, displays the potential to grow at over 8%. The shifting dynamics supporting this growth makes it critical for businesses in this space to keep abreast of the changing pulse of the market. Poised to reach over US$1.6 Billion by the year 2025, Communication Network Infrastructure will bring in healthy gains adding significant momentum to global growth.
Representing the developed world, the United States will maintain a 8% growth momentum. Within Europe, which continues to remain an important element in the world economy, Germany will add over US$81.7 Million to the region's size and clout in the next 5 to 6 years. Over US$85.2 Million worth of projected demand in the region will come from the rest of the European markets.
In Japan, Communication Network Infrastructure will reach a market size of US$149.3 Million by the close of the analysis period. As the world's second largest economy and the new game changer in global markets, China exhibits the potential to grow at 6.7% over the next couple of years and add approximately US$310.1 Million in terms of addressable opportunity for the picking by aspiring businesses and their astute leaders.
Presented in visually rich graphics are these and many more need-to-know quantitative data important in ensuring quality of strategy decisions, be it entry into new markets or allocation of resources within a portfolio. Several macroeconomic factors and internal market forces will shape growth and development of demand patterns in emerging countries in Asia-Pacific.
All research viewpoints presented are based on validated engagements from influencers in the market, whose opinions supersede all other research methodologies.
Competitors identified in this market include:
- AkzoNobel N.V.
- BASF SE
- DaklaPack Group
- Desco Industries Inc.
- Dou Yee Technologies Pte. Ltd.
- DowDuPont Inc.
- GWP Group
- Miller Supply Inc.
- Polyplus Packaging Ltd.
- PPG Industries Inc.
- TIP Corporation Sdn Bhd.
- Uline
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