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BOISE, Idaho, Feb. 28, 2013 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq:MU) ("Micron") today announced the Tokyo District Court's issuance of an order approving Elpida Memory Inc.'s plan of...
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Key Messages: 6 Gb/s SAS interface provides support for dual-port architectures A reliable, high endurance SSD, designed to achieve 10 drive fills per day for five years Micron's XPERT...
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BOISE, Idaho and LANDSHUT, Germany, Feb. 25, 2013 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq:MU) and LFoundry today announced that the companies have entered into agreements for LFoundry to...
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BOISE, Idaho, and TOKYO, Feb. 19, 2013 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq:MU) ("Micron") and Elpida Memory, Inc. ("Elpida") today announced that the Chinese Ministry of Commerce has...
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Key Messages: New 128Gb TLC NAND device is more than 25% smaller than company's same-capacity MLC NAND device Utilizes Micron's award-winning 20-nanometer (nm) process...
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BOISE, Idaho, Feb. 14, 2013 (GLOBE NEWSWIRE) -- What Micron Technology, Inc. (Nasdaq:MU), one of the world's leading providers of advanced semiconductor...
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SAN FRANCISCO, Feb. 11, 2013 (GLOBE NEWSWIRE) -- What Micron Technology, Inc. (Nasdaq:MU), announced today that Ed Doller, vice president of Micron's...
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BOISE, Idaho and SHANGHAI, Feb. 7, 2013 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq:MU), one of the world's leading providers of advanced semiconductor solutions, and TE Connectivity (TE)...
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BOISE, Idaho, Feb. 7, 2013 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq:MU) today announced the pricing of an offering of $270 million aggregate principal amount of its 1.625% convertible...
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BOISE, Idaho, Feb. 5, 2013 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq:MU) today announced that it intends to offer, subject to market and other considerations, $220 million aggregate...